Senior RF ATE Test Engineer, Amazon Leo Silicon Team

Amazon • Redmond, WA

3d

About The Position

Amazon Leo is an initiative to launch a constellation of Low Earth Orbit satellites that will provide low-latency, high-speed broadband connectivity to unserved and underserved communities around the world.

Come work at Amazon!

The Role:
As Senior RF ATE Engineer, you will engage with an experienced cross-disciplinary staff to conceive and design innovative production test solutions for products developed for Amazon LEO phased array antennas satellites and ground terminals. You will work closely with an internal inter-disciplinary team, and third-party suppliers to develop ATE test programs, bringing up high-volume production, and debugging of Return Material Authorization (RMA) for Amazon LEO custom silicon. You must be responsive, flexible and able to succeed within an open collaborative peer environment. The ideal candidate will have a strong background in RF and Mixed signal ATE test methodologies and Strong analytical skills to optimize test strategies, balancing comprehensive quality validation against test cost and throughput objectives. You’ll be part of the team that creates a chip and system test infrastructure and methodology applicable to transmit and receive communication systems.

Export Control Requirement:
Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

Requirements

• Bachelor's degree in Electrical or Communications Engineering or a related field
• 5+ years of experience in RF ATE Test
• Up to 20% international travel required.

Nice To Haves

• Master's degree or Ph.D. degree in Electrical Engineering or related field
• Excellent oral and written communications skills.
• 7+ years experience in mm-wave or RF validation engineering of communications systems, preferably in high-volume consumer devices manufacturing
• Strong technical background in one or more of the following:
• Strong technical background in RF front-end design and characterization, specifically including Power Amplifiers (PA) and Low Noise Amplifiers (LNA)
• RF ATE hardware development and debugging and PCB design/layout requirements and best practices for mm-wave.
• Experience with semiconductor wafer sort testing, including understanding of RF probe-level challenges and associated test methodologies
• Knowledge of ATE hardware de-embedding techniques and their application to measurement accuracy enhancement
• Running firmware on DUTs to reduce test time and increase self-testability.
• Analog DFT and RF-BIST techniques.
• RF test equipment such as network analyzers, spectrum analyzers, oscilloscopes, signal generators
• Experience using probe-stations and load pull measurement equipment
• Transceiver architecture and topology, with comprehensive knowledge of key test parameters and performance metrics
• High volume automated test of beamforming systems such as 5G, 802.11AD, or satellite communications.
• Knowledgeable in production control processes, statistical analysis platforms (Galaxy, Spotfire, JMP or similar), data interpretation/analysis, Cp/Cpk, and bench/tester correlation.
• New product transition from design phase, through qualification and into high volume manufacturing environment.
• Source code control tools (Git, SVN, bitbucket) and bug tracking tools (JIRA).

Responsibilities

• Write test plans for mm-wave SoCs tested on Teradyne/Advantest equipment.
• Develop ATE test programs for Teradyne Ultraflex testers using IGXL, C#, and firmware.
• Architect high-volume test solutions across DUT firmware and tester software to optimize total test cost.
• Review device specifications, collaborate with the design team to apply design for test principles to ensure product manufacturability.
• Own the optimization, standardization, and improvement of test methodologies to enhance operational efficiency in production, ensure product quality and minimize cost.
• Work with lab bench mm-wave test systems or probe stations to correlate bench and ATE results.
• Actively identify test related readiness, issues, and optimizations throughout the product lifecycle and work towards expedient resolutions.
• Develop and transfer to volume production RF and high-speed digital die probing techniques to improve accuracy of identifying good dice and improve yield.
• Interact with suppliers such as foundries and OSATs to complete engineering programs for wafer test, final test, and qualification.

Benefits

• health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage)
• 401(k) matching
• paid time off
• parental leave

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level