Senior Hardware Engineer

Intel Corp.-posted 23 days ago
Full-time • Mid Level
Onsite • Santa Clara, CA
5,001-10,000 employees
Computing Infrastructure Providers, Data Processing, Web Hosting, and Related Services
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Intel Integrated Photonics Solutions (IPS) is at the forefront of silicon photonics integration and is part of The Data Center Group which is at the heart of Intel's transformation from a PC company to a company that powers the cloud and billions of smart, connected computing-devices. Since announcing the world's first hybrid silicon laser nearly a decade ago, our team continues to lead the industry with cutting-edge technology and efficient, scalable high-volume manufacturing. Our dedication to advanced development ensures that Intel Silicon Photonics continues to drive future data center bandwidth growth with smaller form factors, co-packaging and higher speeds from 400G today to 1.6T+ and beyond tomorrow. We are looking for great talent to accelerate this journey so if you are interested in joining our leading organization then we want to hear from you. The team is seeking an experienced Hardware Designer with expertise in SI and PI to support the development of reference module designs, PIC sub-system EVB and other test boards to support product development. Demonstrated expertise in designing 100G/lane and 200G/lane module PCBA, lead the layout execution for high-speed traces, power delivery, require extensive experience with designing PDN for high-speed DSP, RFICs, manage PI and SI requirements, actively guide layout engineer and manage tradeoffs in design. The candidate will be expected collaborate with a cross functional product development team - HW, FW, PIC, EIC, Packaging and thermal, Optics and NPI.

  • Perform SI simulations of high-speed interfaces, RF traces, etc. 100Gbps, 200Gbps NRZ and PAM4 signaling.
  • Modeling of high speed traces with vias, connectors, sockets and various system components in 3D EM tools like HFSS, ADS.
  • Design and optimize Power Delivery Network (PDN) across packages and PCBs.
  • Perform PI sims for IR drop, current density violations, dynamic switching noise analysis to validate board designs.
  • Expertise in designing 100G/lane and 200G/lane module PCBA, lead the layout execution for high-speed traces, power delivery, require extensive experience with designing PDN for high-speed DSP, RFICs, manage PI and SI requirements, actively guide layout engineer and manage tradeoffs in design.
  • Ability to lead hardware design of an optical transceiver and evaluation boards including schematic design, circuit simulation, PCB layout floor planning, design with layout engineer is a plus.
  • Lead PCB bring up working with FW engineers to confirm functionality w.r.t design targets. Validate PCB high speed designs thru product design verification tests and independent PCBA characterization. Troubleshoot and optimize performance of the sub-system/transceiver module boards.
  • Extensive experience with selection of DSP, Driver, TIA, uControllers, DACs, ADCs, Voltage regulators, etc.
  • Key contributor to Product Requirements, Owns PCBA design from concept phase to full final design and EVT/DVT phase of the product.
  • Understand electrical and optical requirements and specifications of optical transceiver MSA. Like 800G DR8/2xFR4, 1.6T DR8/2xFR4, 800G LPO, 1.6T LRO etc.
  • Maintain documentation of a hardware design specification, Pass design check list prior to tape out, BOM specifications and work with NPI team to build PCBA. Lead design reviews and present design summary to management, highlight risks with mitigation plans.
  • Interface and work collaboratively with mechanical engineers, optical engineers, Photonics engineer, firmware engineers, process engineers and test engineers.
  • Interact with program manager, buyer/planner and suppliers to make sure designed parts are available in a timely manner for build and test.
  • M.S. in Electrical Engineering
  • 4+ years of HW/circuit design experience
  • 4+ years of experience in: transceiver electrical design principles, including high speed signal integrity, crosstalk, power integrity, noise, ESD, FW, testing, etc.
  • layout and able to direct layout engineer with clear design priority
  • PI and SI tools (HFSS, ADS, Cadence)
  • high density multiple-layer board design.
  • high volume PCB/substrate fab houses.
  • Ph.D. in Electrical Engineering
  • Strong analog and digital circuit design skills and layout with mixed signal designs.
  • Experience working with AWG, DCAM, VNA/LCA to characterize high speed performance
  • Strong laboratory optical and electrical measurement skills.
  • Strong communication and presentation skills.
  • Experience with micro-controllers and communication protocols such as SPI, I2C, MDIO, CMIS management interface for optical modules.
  • Strong background of digital communication theory.
  • Familiarity with industry standards including IEEE Ethernet standards, OIF standards, PCIe standards and various MSAs.
  • Experience with optical transceiver test and calibration methodologies.
  • Experience working with Marvell, Broadcom, MaxLinear, Credo DSPs in pluggable optical modules.
  • We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation.
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