Senior Engineering Manager, Advanced Packaging and IC Technology (Onsite)

RTX•Cedar Rapids, IA

22d•Onsite

About The Position

Joining Collins Aerospace isn’t just about finding a job; it’s about embarking on a journey to redefine the future of aerospace technology. Collins Aerospace, an RTX company, is a leader in technologically advanced and intelligent solutions for the global aerospace and defense industry. Collins Aerospace has the capabilities, comprehensive portfolio, and expertise to solve customers’ toughest challenges and to meet the demands of a rapidly evolving global market. Our goal is to create technologies that allow Collins to differentiate our products from the competitors’ and create new market opportunities through innovation. That means we need to take risks that, if successful, could lead to large rewards. We’re creating state-of-the-art microelectronics, including: secure system in package processors, 2D/2.5D/3D integrated circuit packages, and multifunction reconfigurable RF integrated circuits for communication, radar, and electronic warfare.

Requirements

Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM) and minimum 10 years prior relevant experience or an Advanced Degree in a related field and minimum 7 years of experience
The ability to obtain and maintain a U.S. government issued secret security clearance is required
Familiarity with US Government bidding process
Experience in generating test plans, leading verification campaigns, writing test reports, and briefing customers
Demonstrated ability to work in a creative, as well as practical problem-solving environment
Demonstrated ability to troubleshoot problems while integrating components or subassemblies
Demonstrated problem-solving skills, and data-driven decision-making
Experience with peer review component/system requirements
Experience in identifying, communicating, and mitigating risks

Nice To Haves

Passion for challenging and developing people
Customer focused
Must be able to complete meaningful work in the absence of complete specifications and help create component requirements as a work in progress
Excellent verbal/written communication and teamwork skills
Demonstrated technical knowledge/expertise in multiple technologies
Knowledgeable of industry trends within his/her domain
Experience in organic and ceramic microelectronics packaging and thermal analysis/cooling approaches
Experience in design and test of RF/microwave/millimeter or analog mixed signal integrated circuits
Bid & proposal resulting in successful capture of funding
Experience with environmental effects testing
Understanding earned value management, prior cost account management preferred

Responsibilities

Lead a team of talented engineers in research & development in microelectronics integrated circuit and secure packaging technology
Hire engineers to complement and supplement team trajectory
Provide technical coaching and mentoring to team members, including onboarding, development, and guidance in research and design processes
Manage a team of 10-14 contributors, addressing performance and development, while planning and organizing team responsibilities
Leverage advanced principles, theories, and concepts of complex technical subjects to provide direction for employees
Actively addresses employee performance and development issues
Apply critical thinking to solve complex problems and explore new ideas/approaches
Lead continuous improvement projects that result in new approaches and techniques to product development
Oversee performance of assigned project tasks (including technical, cost, schedule, design to cost, product integrity and manufacturability)
Foster collaboration across internal and external stakeholders, including customers, subcontractors, product development teams, and program management peers.
Collaborate with product development personnel throughout Collins and RTX to transition technology into our future product offerings
Interfaces with external agencies, internal customers, tool vendors, and partner organizations within the company to ensure effective two-way communication of needs and results
Development of internal and external networks, forging relationships with peers in the Program Management Team (Engineering, Business Development, and Program/Product Management.)
Interface with engineers and value stream leaders from multiple product lines to understand technology needs
Present technology concepts to customers/subcontractors
Coach team members in principal investigator (PI) role for research
Recommend projects for independent research & development (IR&D) investments
Lead team members through pursuit & order capture activities for externally-funded R&D
Maintains awareness of technology within the domains of integrated circuits and microelectronics packaging
Translate processor & RF/analog integrated circuit component performance to impact on system performance
Up to 15% travel to domestic and internationally

Benefits

Medical, dental, and vision insurance
Three weeks of vacation for newly hired employees
Generous 401(k) plan that includes employer matching funds and separate employer retirement contribution, including a Lifetime Income Strategy option
Tuition reimbursement program
Student Loan Repayment Program
Life insurance and disability coverage
Optional coverages you can buy pet insurance, home and auto insurance, additional life and accident insurance, critical illness insurance, group legal, ID theft protection
Birth, adoption, parental leave benefits
Ovia Health, fertility, and family planning
Adoption Assistance
Autism Benefit
Employee Assistance Plan, including up to 10 free counseling sessions
Healthy You Incentives, wellness rewards program
Doctor on Demand, virtual doctor visits
Bright Horizons, child and elder care services
Teladoc Medical Experts, second opinion program
Eligible for relocation assistance
And more!