Senior Chemical & Materials Engineering (Onsite)

RTX

7d•Onsite

About The Position

Joining Collins Aerospace isn’t just about finding a job; it’s about embarking on a journey to redefine the future of aerospace technology. Collins Aerospace, an RTX company, is a leader in technologically advanced and intelligent solutions for the global aerospace and defense industry. Collins Aerospace has the capabilities, comprehensive portfolio, and expertise to solve customers’ toughest challenges and to meet the demands of a rapidly evolving global market. We are seeking problem solvers, creative thinkers, and collaborative, disciplined, and self-motivated engineers to join our Microelectronics Engineering Group, a subgroup within Applied Research & Technology (ART). Within ART, we develop and build communication and avionics electronic solutions. Our team is seeking a motivated and experienced Process Engineer for this role. The engineer in this position will lead the development and sustainment of electroplating modules and will support in-line and end-of-line data analytics across Z-Fab technology. Z-Fab is our Collins Microelectronics process, used to create wafer-scale, 3D passive, thick-metal components. This position will support our Cedar Rapids, IA location.

Requirements

Typically requires a University Degree and minimum 5 years of prior relevant experience or an Advanced Degree and a minimum of 3 years' experience
U.S. Citizen - U.S. citizenship is required, as only U.S. citizens are authorized to access information under this program/contract
Must have experience with microfabrication electroplating process
Understanding of the fundamentals of data analytics, statistics, and Design of Experiments (DOE)

Nice To Haves

Prefer PhD in science, technology or engineering, with experience in semiconductor electroplating and data analytics
Experience working in microelectronic fabrication environment.
Understanding wafer characterization techniques and end-of-line (EOL) failure mechanisms
Understanding statistical process control (SPC) and metrology
Design and develop mechanical tooling for microelectronic devices.
Demonstrated ability to plan and manage projects, troubleshoot problems, identify root causes, and implement creative corrective actions
An active and transferable U.S. government issued Secret security clearance is preferred prior to start date.
U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance

Responsibilities

This role is responsible for developing, implementing, and sustaining all electroplating processes
Responsible for developing and transferring processes to the operations group
The engineer is expected to document process details and drive the continuous improvement of the process capability index (CpK) across all electroplating modules
Responsible for the development of fabrication processes for the next generation of products
The engineer's focus will be on Collins' Z-Fab 3D micro-scale fabrication manufacturing capability

Benefits

Medical, dental, and vision insurance
Three weeks of vacation for newly hired employees
Generous 401(k) plan that includes employer matching funds and separate employer retirement contribution, including a Lifetime Income Strategy option
Tuition reimbursement program
Student Loan Repayment Program
Life insurance and disability coverage
Optional coverages you can buy: pet insurance, home and auto insurance, additional life and accident insurance, critical illness insurance, group legal, ID theft protection
Birth, adoption, parental leave benefits
Ovia Health, fertility, and family planning
Adoption Assistance
Autism Benefit
Employee Assistance Plan, including up to 10 free counseling sessions
Healthy You Incentives, wellness rewards program
Doctor on Demand, virtual doctor visits
Bright Horizons, child and elder care services
Teladoc Medical Experts, second opinion program
And more!