Semiconductor Backside Process Execution Lead

RTX•Andover, MA

3d•Onsite

About The Position

An exciting opportunity exists at Raytheon Missiles & Defense (RMD) for a Semiconductor Backside Process Execution Lead to join our III-V process development team working on gallium nitride based devices and III-V focal plane array fabrication within the Advanced Microelectronics Solutions (AMS) Department. This role requires a broad understanding of microelectronics processing techniques such as deposition, etch, photolithography, metrology, and process characterization with expertise in one or more of these areas. The ideal candidate with have experience in backside processing. As a member of the AMS Department, the individual in this role will serve as a process development engineer to lead and execute process development efforts, assist in process sustainment, improve product yield, develop new processes and device capabilities, and assist in the creation of new technology discriminators in a III-V semiconductor wafer foundry. The chosen candidate is expected to be an innovative and creative thinker capable of probing issues and reaching solutions both independently and in a team environment. A significant portion of the role involves developing proof of concept demonstrations of novel semiconductor processes, identifying the yield and process improvement opportunities that exist, gathering sponsorship and team resources, and executing on continuous improvement activities. Presence on the foundry floor is essential for improving various processes and quick resolution of technical issues. The role requires a large degree of multitasking with attention to detail while managing priorities depending on the nature of the problems and the commitments to customers or program leads.

Requirements

Bachelor’s in Science, Technology, Engineering, or Mathematics (STEM) and 5 years of prior relevant experience, OR a Master’s in STEM and 3 years of prior relevant work experience OR a PhD in STEM, in semiconductor processing techniques such as: photo lithography, dry etching, metals evaporation, and optical or scanning electron microscope inspections
The ability to obtain and maintain a US security clearance.
U.S. citizenship is required as only U.S. citizens are eligible for a security clearance

Nice To Haves

A Master’s or PhD in STEM.
Ability to clearly and succinctly document and present process development status in a team meeting
Experience troubleshooting a wide set of fabrication equipment in addition to establishing equipment qualification and preventative maintenance procedures
Proficient in statistical process control and lean manufacturing methods (eg, Six Sigma)
Excellent communication skills with the ability to communicate ideas effectively
Broad knowledge related to semiconductor processing, device physics, and data analysis
Ability to work with large datasets
Experience in a data analysis software packages (e.g. MATLAB, Python, SQL, JMP)
Ability to lead and coordinate technical projects with cross-functional teams
Experience with characterizing, understanding, and improving semiconductor device performance and reliability

Responsibilities

lead and execute process development efforts
assist in process sustainment
improve product yield
develop new processes and device capabilities
assist in the creation of new technology discriminators in a III-V semiconductor wafer foundry
developing proof of concept demonstrations of novel semiconductor processes
identifying the yield and process improvement opportunities that exist
gathering sponsorship and team resources
executing on continuous improvement activities
improving various processes and quick resolution of technical issues
managing priorities depending on the nature of the problems and the commitments to customers or program leads