- Focused area Molecular dynamics simulation, quantum chemistry modeling, MD forcefield development, machine learning and/or AI development for physical modeling, and high-performance computation Surface chemistry, - Responsibilities Investigation and establishment of plasma etching reaction mechanism for various semiconductor processes using computational physical modeling Proposing and support verification of new process methods and hardware improvements through working with experimentalists and process engineers Development and assessing quality of MD forcefield for plasma etching system Integration of various modeling methodologies for plasma etching behavior predictions Promote collaborative works among TEL global sites and teams Typical Education and Experience: PhD degree in chemistry, chemical engineering, material science, or related areas, with research experience focused on chemical reactions, surface chemistry, and surface modification.
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Job Type
Full-time
Career Level
Mid Level
Education Level
Ph.D. or professional degree