R&D Engineer IC Design

Broadcom • San Jose, CA

7d

About The Position

We are part of the core switching group (CSG) at Broadcom developing industry leading network switches for enterprise and mega scale data centers . We are looking for experienced engineers to design cutting edge CoWos 2.5D , 3D interposer designs. You will be working on designing interposers starting with custom routing for high speed interfaces, bump map design , routing and physical verification and tapeout to the foundries. As part of your job you will be interacting with packaging , signal integrity and foundries to meet the packaging, SI and physical requirements of the interposers. Experience with interposer designs including CoWoS, 2.5D/3D integration using Cadence Innovus/Integrity or Synopsys 3DIC compiler is a must. Candidates should have a strong understanding of TSV design, micro-bumps, solder bumps, and interconnect technologies. Strong automation expertise related to bump pattern generation , routing structure development for high speed interfaces, and chip finishing are required to handle multiple Interposer designs in parallel. Basic understanding of routing structure impact on high-speed signal integrity (SI), power integrity (PI), and thermal analysis is required.

Requirements

• Experience with interposer and advanced packaging design, including CoWoS, 2.5D/3D
• Proficiency with EDA tools such as Cadence (Innovus, Integrity), Synopsys (3DIC compiler), Mentor Graphics (Calibre) for layout generation, editing and verification
• Strong understanding of TSV design, micro-bumps, solder bumps, and interconnect technologies.
• Basic understanding of high-speed signal integrity (SI), power integrity (PI), and thermal analysis.
• Familiarity with semiconductor fabrication processes, particularly for silicon interposers.
• Strong scripting skills (Python, Tcl, SKILL) for automation and flow customization.
• Ability to work with cross-functional teams including IC design engineers, packaging egineers, and foundries
• Bachelor’s in Electrical Engineering, Microelectronics, or related fields and 8+ years of related experience, or a Master’s degree and 6+ years of related experience

Nice To Haves

• Hands-on experience with high-density interposers in complex packaging environments.
• Strong scripting skills to automate the interposer design flow
• Previous experience at semiconductor or advanced packaging companies.
• Familiarity with 3DBlox interposer modelling language is a plus

Benefits

• Medical, dental and vision plans
• 401(K) participation including company matching
• Employee Stock Purchase Program (ESPP)
• Employee Assistance Program (EAP)
• company paid holidays
• paid sick leave and vacation time

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 5,001-10,000 employees