IC Package Mechanical FEA Engineer (R&D)

Broadcom • Fort Collins, CA

2d

About The Position

Broadcom is seeking an experienced package mechanical FEA engineer for very-large and complex packages for industry-leading ASICs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. You'll have exposure to emerging package integration technologies, such as co-packaged fiber-optic transceivers and connectors and complex chip stacking (3DIC, hybrid copper bonding, heterogeneous integration, etc). Also, you will develop and optimize unique multi-chip-module (MCM) packages and mainstream flip-chip BGA (FCBGA) packages. You'll have the opportunity to collaborate with the R&D and manufacturing teams to influence the mechanical design of new ASICs, and make engineering trade offs with warpage, stress, reliability, cost, thermal and electrical performance, etc.

Requirements

• Bachelors in Mechanical Engineering or similar field and 12+ years of experience in FEA modeling or Masters in Mechanical Engineering or similar field and 10+ years of experience in FEA modeling or PhD in Mechanical Engineering or similar field and 7+ years of experience in FEA modeling.
• Ability to evaluate complicated numerical simulation results against first principles such as strength of materials solutions
• Ability to calibrate modeling and results with existing empirical data
• Perform mechanical testing and measurement
• Devise lab scale tests to validate analyses
• Seek mechanical solutions at the intersection of manufacturing limitations, required reliability and customer expectations
• Ansys Classic/Mechanical experience is preferred. Equivalent tool is OK
• Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers
• Self-management and organization skills
• Presentation and technical documentation skills

Responsibilities

• Design responsibility for mechanical design aspects of ASIC packages
• Use advanced FEA to quantify and optimize reliability and manufacturing
• Measure and experiment to validate understanding and improve model accuracy
• Collaborate closely with package designers, reliability and manufacturing partners (internal and external)
• Schedule, prioritize, & track your work across 4+ projects simultaneously
• Create presentations for and present to various audiences : engineers, managers, senior management, customers, and vendors
• Document design rules and guidelines

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 5,001-10,000 employees