R&D Product Engineer: IC and System-in-Package

Keysight Technologies, Inc.•Santa Rosa, CA

17d•Onsite

About The Position

Keysight is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do. Our award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers. This role is part of the High Frequency Technology Center (HFTC) at our Headquarters in Santa Rosa, CA. HFTC is part of Keysight’s Advanced Technology Labs, the core R&D organization that enables Centers of Excellence and other business groups to provide RF, microwave, mmWave, 5G and 6G solutions to customers in various industries, including communications, aerospace & defense, automotive & energy, and semiconductor industries. HFTC technologies include InP and GaAs-based HBTs, HEMTs, and diodes, as well as high-frequency System in Package (SiP) solutions.

Requirements

Bachelor's, Master's, or PhD in Electrical/Electronics Engineering, or related fields
3+ years of relevant experience
RF measurement competence: Hands-on experience with RF measurement and characterization for IC/SiP validation and failure analysis (e.g., s-parameters, noise figure, phase noise, time-domain measurements, etc.)
Semiconductor fundamentals: Familiarity with device physics (BJTs, FETs) and circuit design principles
Data analysis/statistics: Experience with data analysis and statistical tools
Must have strong self-initiative and proactive attitude
Demonstrated ability to take ownership of projects and drive them to completion
Strong communication skills with the ability to partner effectively with customers, operations, and cross-functional engineering teams
Ability to facilitate discussions with multiple stakeholders and experts and make informed decisions
Excellent problem-solving skills and attention to details
Ability to work in a fast-paced and dynamic environment, manage multiple projects and meet deadlines
Candidates must be local or willing to relocate to Santa Rosa, CA
Candidates must be a U.S. citizen or lawful permanent resident of the U.S., protected individual under 8 U.S.C. 1324b(a)(3).

Nice To Haves

Failure analysis and reliability: Knowledge of failure analysis techniques and reliability engineering is a significant plus

Responsibilities

Lead new circuit/SiP introduction by ensuring new products meet performance, quality, and manufacturability standards
Support IC and SiP forward flow production, analyze and interpret test data to identify trends, and find solutions for manufacturing issues and deviations
Perform bench-level testing, characterization, and debug of ICs and SiPs
Own RMA and root‑cause investigations, coordinating with internal customers and communicating technical findings to both engineering teams and customers when needed
Support continuous improvement initiatives in test correlation, production stability, reliability screening, and data‑driven decision-making