Quality Engineer

OMNIVISION•Santa Clara, CA

About The Position

The Quality Engineer will assure quality throughout the product lifecycle, encompassing product development, manufacturing, failure analysis, production release, and servicing. This role involves planning and executing quality strategies during design and development by defining standard operating procedures for electrical quality control and assurance, mitigating risks, and correcting issues during ramp-up. The engineer will lead automotive quality improvement initiatives, implementing proactive measures to reduce test-related quality incidents, driving cross-department Lessons Learned activities for manufacturing and test items, improving outgoing electrical quality control processes, and managing Safe Launch and High Voltage Stress Testing for automotive products. Key responsibilities include ensuring product quality and reliability through statistical yield analysis techniques such as Statistical Yield and Bin Limit (SYL, SBL) evaluations. The position requires performing failure analysis using pFA and eFA tools such as cross-sectioning, emission microscopy, X-ray analysis, SEM (Scanning Electron Microscope), optical microscopy, oscilloscope probing, and OBIRCH to identify failure modes, localize physical hot spots, and determine root causes. The engineer will also conduct FMEA (Failure Mode and Effect Analysis) and statistical data analysis using MATLAB, Visual C, Excel, and internal OVT tools for reliability and yield assessments. Handling customer complaint (CCN) cases and customer return analyses, providing detailed failure reports, and coordinating with cross-functional teams for corrective actions are also part of the role. Direct communication with end customers and supply chain partners, including package houses and foundries (e.g., TSMC), to resolve quality and process issues identified during IC manufacturing, applying IC fabrication knowledge to evaluate wafer- or process-related deviations, and providing remote support for customers with multi-region manufacturing sites producing camera modules and automotive imaging products are essential. Finally, the role involves driving Corrective and Preventive Actions (CAPA) across functional engineering teams to ensure continuous improvement, enhance product robustness, and maintain stable production quality.

Requirements

Master’s degree or foreign equivalent degree in Electrical Engineering, Computer Engineering, or a related field.
Knowledge of Digital IC design
Knowledge of IC fabrication
Knowledge of C programming
Knowledge of RTL design
Knowledge of VHDL programming
Knowledge of Verilog programming
Knowledge of Semiconductor physics
Knowledge of Reliability prediction

Responsibilities

Assure quality throughout the product lifecycle, including product development, manufacturing, failure analysis, production release, and servicing.
Plan and execute quality strategies during the design and development phases by defining standard operating procedures for electrical quality control and assurance, ensuring that risks are mitigated and issues are promptly corrected during ramp-up.
Lead automotive quality improvement initiatives by implementing proactive measures to reduce test-related quality incidents, driving cross-department Lessons Learned activities for manufacturing and test items, improving outgoing electrical quality control processes, and managing Safe Launch and High Voltage Stress Testing for automotive products.
Ensure product quality and reliability through statistical yield analysis techniques such as and Statistical Yield and Bin Limit (SYL, SBL) evaluations.
Perform failure analysis utilizing pFA and eFA tools — including cross-sectioning, emission microscopy, X-ray analysis, SEM (Scanning Electron Microscope), optical microscopy, oscilloscope probing, and OBIRCH — to identify failure modes, localize physical hot spots, and determine root causes.
Conduct FMEA (Failure Mode and Effect Analysis) and statistical data analysis — such as box plots, histograms, distributions, scatter charts, normalization, and linearity — using MATLAB, Visual C, Excel, and internal OVT tools for reliability and yield assessments.
Handle customer complaint (CCN) cases and customer return analyses, providing detailed failure reports and coordinating with cross-functional teams to identify root causes and implement corrective actions.
Communicate directly with end customers and supply chain partners, including package houses and foundries (e.g., TSMC), to resolve quality and process issues identified during IC manufacturing. Apply IC fabrication knowledge to evaluate wafer- or process-related deviations.
Provide remote support for customers with multi-region manufacturing sites producing camera modules and related automotive imaging products.
Drive Corrective and Preventive Actions (CAPA) across functional engineering teams to ensure continuous improvement, enhance product robustness, and maintain stable production quality.