Quality Engineer

Semtech•Colorado Springs, CO

1d•Onsite

About The Position

We are seeking an experienced Quality Engineer with chip-scale packaging (CSP) and semiconductor backend assembly expertise to support our wafer-level and flip chip manufacturing operations. This role combines hands-on quality engineering with supplier quality management, focusing on process qualification, device characterization, corrective action leadership, and new product introduction (NPI). The ideal candidate brings deep technical knowledge of semiconductor packaging processes, proven ability to drive quality improvements through data-driven problem-solving, and skill in building collaborative relationships across engineering, manufacturing, and supplier organizations. This is a permanent, full-time position offering the opportunity to directly impact product quality and manufacturing excellence in a high-reliability semiconductor environment.

Requirements

Bachelor's degree in Engineering, Materials Science, Physics, or related technical field
5+ years of quality engineering experience in semiconductor backend assembly or microelectronics packaging
Direct hands-on experience with chip-scale packaging technologies including flip chip, wafer-level CSP, or advanced packaging processes
Demonstrated expertise in 8D methodology, root cause analysis (5-Why, fishbone, fault tree), and structured problem-solving
Strong statistical analysis skills including SPC, process capability (Cpk/Ppk), hypothesis testing, and Design of Experiments (DOE)
Working knowledge of AIAG Core Tools: PFMEA, Control Plans, MSA, PPAP, and APQP
Experience with ISO 9001 or equivalent quality management systems
Proficiency with statistical analysis software (Minitab, JMP, or equivalent) and Microsoft Office suite
Excellent written and verbal communication skills with ability to influence across organizational levels
Proven track record of building collaborative relationships with engineering, manufacturing, and supplier organizations

Nice To Haves

Master's degree in Materials Science, Engineering, or related technical field
Six Sigma Green Belt or Black Belt certification
Certified Quality Engineer (CQE) or Certified Quality Auditor (CQA) from ASQ
ISO 9001 or IATF 1649 Lead Auditor certification
Experience with wafer fabrication processes (etch, PVD, lithography, thin films) to support packaging integration
Direct experience with flip chip bumping, redistribution layer (RDL) processes, or advanced wafer-level packaging
Supplier quality experience with OSATs (Outsourced Semiconductor Assembly and Test) or foundries
Familiarity with automotive (IATF 1649), aerospace (AS9100), or medical device (ISO 13485) quality standards
Experience with reliability testing including temperature cycling, HAST, HTOL, and failure analysis techniques
Knowledge of semiconductor metrology and characterization techniques (SEM, X-ray, C-SAM, profilometry)
Advanced DOE expertise including fractional factorial, response surface methodology, and Taguchi methods
Experience with MES systems and quality data management platforms

Responsibilities

Support qualification and validation of chip-scale packaging processes including flip chip, wafer-level CSP, die attach, molding, and plating operations
Conduct statistically rigorous device characterization across process, voltage, and temperature (PVT) conditions to verify performance margins and detect reliability risks
Design and execute Design of Experiments (DOE) to optimize packaging process parameters, identify critical factors, and improve process robustness
Apply Statistical Process Control (SPC) methodologies to monitor critical process parameters and process capability (Cpk/Ppk) for packaging operations
Perform Measurement System Analysis (MSA) and Gage R&R studies to validate inspection and test equipment capability
Support new product introduction (NPI) through process validation (IQ/OQ/PQ), first article inspection (FAI), and production readiness activities
Develop and maintain Process FMEAs (pFMEA), Control Plans, and process documentation for packaging operations
Investigate and resolve quality issues related to packaging processes including solder joint integrity, die cracking, underfill defects, warpage, and assembly yield
Lead corrective action reports (CARs) using 8D methodology and structured root cause analysis (5-Why, fishbone, fault tree analysis)
Partner with engineering and manufacturing teams to close open CARs through collaborative problem-solving, ensuring root causes are properly addressed and corrective actions are effective
Facilitate cross-functional failure analysis and multi-factor experiments to identify process sensitivities and root causes
Track CAR closure progress and provide status reporting to Quality Director and site leadership
Verify effectiveness of implemented corrective actions through data analysis and follow-up validation
Support continuous improvement initiatives using Lean/Six Sigma methodologies and DMAIC problem-solving
Manage supplier non-conformances (SCARs), corrective actions, and performance improvement initiatives
Coordinate with suppliers on process change notifications (PCNs), engineering changes, and qualification requirements
Support supplier business reviews monitoring SPC data, yield trends, and reliability metrics
Support maintenance of ISO 9001 quality management system and transition to IATF 1649 automotive standards
Participate in internal audits and external certification activities as technical subject matter expert
Review and approve quality documentation including procedures, work instructions, and process specifications
Ensure compliance with customer-specific quality requirements and aerospace/automotive industry standards