Packaging Module Development Engineer

Intel • Chandler, AZ

3d • Onsite

About The Position

Join our team to work on cutting-edge applications of machine vision and machine learning to solve complex semiconductor packaging manufacturing challenges. Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages. Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design. Conducts tests and research on basic materials and properties. Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance. Provides consultation concerning packaging problems and improvements in the packaging process. Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and judgment.

Requirements

• Possess a Bachelor's degree in Engineering, Physics, or Computer Science or related field with 3+ months of experience -OR- master's degree in engineering, Physics, or Computer Science or related field with 6+ months of experience
• Optics fundamentals as applied to imaging techniques (light sources, resolutions, algorithm applications), light-matter interaction.

Nice To Haves

• Semiconductor Inspection (wafer, package, etc.)
• Fundamental physical processes, troubleshoot complex ultra-high precision equipment across a variety of disciplines including optical, laser, motion or electrical systems.
• Statistical principles, process control (SPC) and Design of Experiments (DOE).
• Fundamental scientific and engineering principles to develop novel design solutions for high volume manufacturing processes.
• Semiconductor devices and packing technology.
• Data science and statistics tools (Python is highly preferred).
• Data management and visualization experience.
• Dimensional management for package features and planes.
• Optics fundamentals as applied to imaging techniques (light sources, resolutions, algorithm applications), light-matter interaction.
• Machine Vision techniques, OpenCV experience and CNN Image Classification.

Responsibilities

• project management
• package design/development
• sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units
• thermal/mechanical/electrical design
• analysis, and development of electronic packages
• Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design
• Conducts tests and research on basic materials and properties
• Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance
• Provides consultation concerning packaging problems and improvements in the packaging process
• Responds to customer/client requests or events as they occur
• Develops solutions to problems utilizing formal education and judgment

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel .

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level
• Number of Employees: 5,001-10,000 employees