Packaging Module Development Engineer
About The Position
The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing. The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by: Developing First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions to support Intel’s future packaging platforms. Collaborating with multifunctional and cross-organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability. Innovating next generation materials, equipment, and fabrication processes to enhance semiconductor packaging capabilities at scale. Managing projects to meet product development timelines. Applying formal education and judgment to solve technical problems. Providing sustaining support for equipment performance and process health in high-volume manufacturing. Responding promptly to foundry customer requests and events. The ideal candidate will demonstrate: Technical leadership, strategic planning, and critical thinking. Ability to coach and develop technical teams. Tolerance for ambiguity and adaptability in a dynamic environment. Flexibility in managing changing priorities and responsibilities. Experience leading teams in a highly matrixed organization. Initiative and ability to work independently. Strong communication, influencing, technical, and analytical skills. This position requires regular onsite presence.
Requirements
- You must possess the below minimum qualifications to be initially considered for this position.
- PhD with one or more years in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or a related field.
- Minimum GPA of 3.5.
- At least one publication in a peer-reviewed technical journal.
- Must have the required degree prior to your start date.
Nice To Haves
- One or more years of experience in any of the following:
- Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE).
- Delivering results for complex, time-critical technical projects.
- Semiconductor fabrication processes and technology.
- Previous related work experience in a semiconductor foundry.
Responsibilities
- Developing First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions to support Intel’s future packaging platforms.
- Collaborating with multifunctional and cross-organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
- Innovating next generation materials, equipment, and fabrication processes to enhance semiconductor packaging capabilities at scale.
- Managing projects to meet product development timelines.
- Applying formal education and judgment to solve technical problems.
- Providing sustaining support for equipment performance and process health in high-volume manufacturing.
- Responding promptly to foundry customer requests and events.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation.
- Find more information about all of our Amazing Benefits here: https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003
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What This Job Offers
Job Type
Full-time
Career Level
Entry Level
Education Level
Ph.D. or professional degree
Number of Employees
5,001-10,000 employees
