Packaging Module Development Engineer

Intel • Chandler, AZ

8d • Hybrid

About The Position

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing. As a Packaging Module Development Engineer , you will. Contribute to the advancement of technology and foundry capabilities by developing First‑Level and Second‑Level Interconnect (FLI/SLI) and thermal solutions to support Intel’s future packaging platforms. Collaborate with multifunctional, cross‑organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability. Drive innovation in next‑generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high‑volume manufacturing. Manage projects to ensure alignment with product development schedules and execution milestones. Apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges. Provide sustaining engineering support to maintain equipment performance and process health in high‑volume manufacturing environments Respond effectively and with urgency to foundry customer requests, escalations, and manufacturing events The ideal candidate will demonstrate: Technical leadership, strategic planning, and critical thinking. Ability to coach and develop technical teams. Tolerance for ambiguity and adaptability in a dynamic environment. Flexibility in managing changing priorities and responsibilities. Experience leading teams in a highly matrixed organization. Initiative and ability to work independently. Strong communication, influencing, technical, and analytical skills. This position requires regular onsite presence.

Requirements

• PhD with one or more years in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field.
• Minimum cumulative GPA of 3.5.
• At least one publication in a peer-reviewed technical journal.
• Must have the required degree prior to your start date.

Nice To Haves

• One or more years of experience in one or more of the following areas:
• Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE)
• Delivery of results for complex, time-critical technical projects.
• Semiconductor fabrication processes and technologies.
• Prior related work experience within a semiconductor foundry.

Responsibilities

• Contribute to the advancement of technology and foundry capabilities by developing First‑Level and Second‑Level Interconnect (FLI/SLI) and thermal solutions to support Intel’s future packaging platforms.
• Collaborate with multifunctional, cross‑organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Drive innovation in next‑generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities
• Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high‑volume manufacturing.
• Manage projects to ensure alignment with product development schedules and execution milestones.
• Apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges.
• Provide sustaining engineering support to maintain equipment performance and process health in high‑volume manufacturing environments
• Respond effectively and with urgency to foundry customer requests, escalations, and manufacturing events

Benefits

• We offer a total compensation package that ranks among the best in the industry.
• It consists of competitive pay, stock, bonuses, as well as benefit programs which include health, retirement, and vacation.
• Find more information about all of our Amazing Benefits here .

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level
• Education Level: Ph.D. or professional degree
• Number of Employees: 5,001-10,000 employees