Packaging Engineer E5
About The Position
Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits. Location: The successful candidate will be in Santa Clara, CA as a member of a global diverse cross functional team responsible for developing new modules in Advanced Semiconductor Packaging. Education: MS or PhD in Electrical, Mechanical Engineering, Material Engineering or equivalent Technical Expertise: wafer to wafer bonding - including fusion and hybrid bonding, complex heterogeneous wafer level packaging, TSV, die to wafer bonding, advanced substrate and chip on wafer stacking.
Requirements
- MS or PhD in Electrical, Mechanical Engineering, Material Engineering or equivalent
- wafer to wafer bonding - including fusion and hybrid bonding, complex heterogeneous wafer level packaging, TSV, die to wafer bonding, advanced substrate and chip on wafer stacking.
- Program management
- Timeline management
- Budget Management
- Strong Interpersonnel skills
- Leadership
- Oral and written communications in English
Responsibilities
- Program Managing customer engagements in Advanced Packaging, with focus on thermal management, by creating timelines, budgets, manage the technology risks, create roadmaps and execute to set plans to budget and time.
- Developing new modules leveraging Applied’s wide equipment portfolio and help advice the packaging Business Unit on equipment requirements for Advanced semiconductor packaging.
- Filing new patentable developments.
- Being an engineering expert in semiconductor packaging and help drive cross functional projects by working with engineers, managers and Senior/Managing directors across Applied’s business units, including the packaging business unit.
- Helping structure and maintain Applied’s roadmap in Packaging modules.
- Representing Integration Module Solutions (IMS) as a module specialist to various business units within Applied and to customers, outside Applied.
- Defining engineering plans, design DOEs, help characterize and create engineering reports for advanced packaging.
- Creating roadmaps for some packaging applications and helping to shepherd Applied’s product portfolio.
- Lead project across organization and culture in a fast-paced environment
- Self-starter, team player and able to work independently with minimal supervision
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
Number of Employees
5,001-10,000 employees
