Process Integration engineer - E5
About The Position
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips - the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world - like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. What We Offer Salary: $176,000.00 - $242,000.00 Location: Santa Clara,CA You'll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more. At Applied Materials, we care about the health and wellbeing of our employees. We're committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.
Responsibilities
- Process Integration & Development: Define, develop, and optimize advanced packaging process flows (e.g., TSV, RDL, bump, hybrid bonding, die stacking).
- Cross-Functional Collaboration: Lead technical projects to integrate packaging needs into product designs, ensuring Design for Manufacturability (DFM) and Design for Reliability (DFR).
- Design of Experiments (DOE): Plan and execute wafer-level and package-level experiments to optimize unit processes (dielectric deposition, plating, etching, CMP, bonding).
- Yield & Failure Analysis: Analyze electrical, physical, and defect data to root-cause yield limiters and implement corrective actions.
- Vendor Management: Collaborate with OSATs and substrate manufacturers to define equipment/material roadmaps, track NPI (New Product Introduction), and ensure ramp-up readiness.
- Technical Leadership: Proactively identify and mitigate risks related to silicon-to-package interaction (SPI), warpage, and thermal management Lead advanced packaging process integration for high performance interconnect and microLED panel.
- The job requires providing solutions that are highly creative, and directly contribute to product differentiation.
- Will be responsible to establish integration flow with manufacturability and reliability.
- Work closely with fab, assembly, substrate, connector partners, and collaborate with multi-functional teams within Applied and external partners Teams up with Design & Engineering modules (design, process, packaging, metrology teams) to deliver successful products Teams up with Product Marketing to understand the Product Marketing plans, and Product Roadmap
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
Education Level
No Education Listed
Number of Employees
5,001-10,000 employees
