Package Design Engineer

Celestial AI • Santa Clara, CA

46d • $195,000 - $235,000 • Onsite

About The Position

We are seeking an experienced Package Designer with expertise in heterogeneous integration. The ideal candidate will have a strong background in semiconductor packaging design to drive Celestial AI's Photonic Fabric Package solutions. This role requires cross-functional design collaboration with multiple engineering groups, such as Packaging, ASIC, AMS, Photonics, and external partners to ensure design for manufacturing, assembly, reliability, and cost.

Requirements

• BS/MS/PhD in EE/ECE/MSE/ME/ChemE or related disciplines.
• 5-10 years of experience in Semiconductor Packaging Design of heterogeneous architectures, including silicon interposer and RDL designs.
• Extensive experience working with advanced packaging design tools such as Cadence APD.
• Experience working with MCAD tools such as SolidWorks, AutoCAD and interconversion of package design databases to MCAD files.
• Knowledge and insights to deliver high density/high performance interconnects in various 2.5D/3D packaging technologies including InFO, CoWoS, FoCoS and EMIB.
• Good understanding of cross-functional packaging areas: Si floor plan, package, board layout and architecture, design rules, BOM, enabling material/process technologies, thermal, mechanical, Signal/Power Integrity, design for manufacturing, assembly, reliability, and cost.
• Proven track record of working with substrate vendors to meet design for manufacturing, yield, and reliability.
• Proven track record of engagement with OSATs to meet assembly requirements and drive new developments to meet new product requirements.
• Experience in High Speed Signaling best practices, Signal and Power integrity requirements.
• Strong analytical, problem-solving, cross-functional collaboration, project management, and technical presentation skills.

Nice To Haves

• Expertise in heterogeneous integration, fan-out packaging, chiplet architectures - co-design, layout, and netlist management.
• Knowledge of Signal and Power Integrity.
• Experience in substrate vendor and OSAT assembly engagement to meet manufacturing and assembly requirements.
• Familiarity with photonics packaging is a plus but not necessary.

Responsibilities

• Lead Si/package/PCB/system co-design work collaborating with downstream system design teams and upstream ASIC designers to develop a portfolio of packages that meets a huge range of performance design points, while optimizing re-use in other Celestial AI products.
• Scope all aspects of package design feasibility at Silicon interposer and substrate level for multi-chip SiP packaging.
• Support pre/post silicon bring up, yield improvement activities, qualification, failure analysis, and system implementation.
• Lead all aspects of package layout based on I/O, SI-PI and form factor requirements, including routing, design for reliability, thermal, mechanical, manufacturability, bumping, substrate, material selection, assembly, and support for testing.
• Meet specifications for high-speed interfaces such as HBM, DDR, PCIe and 56G/112G SerDes.
• Plan and execute Silicon interposer and RDL based design layout solutions for advanced packaging architectures.
• Netlist management for heterogeneous chiplet assemblies using latest EDA solutions.
• Supporting activities related to production and assembly of IC packages with substrate suppliers and OSATs.
• Work with cross-functional teams and support package integration and architecture efforts with vendors.
• Actively participate in qualification of package and board level assembly with sensitivity to physics of failures for high thermo-mechanical reliability, driving appropriate test vehicle definition and design.
• Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts by Celestial AI

Benefits

• We offer great benefits (health, vision, dental and life insurance), collaborative and continuous learning work environment, where you will get a chance to work with smart and dedicated people engaged in developing the next generation architecture for high performance computing.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Industry: Publishing Industries
• Number of Employees: 101-250 employees