Mechanical Engineer

MACOM Technology Solutions Holdings, Inc.•Morgan Hill, CA

56d•$69,000 - $113,000

About The Position

Support new product introductions from concept through production release, providing critical mechanical design input for RF power and photonics products. Develop mechanical/manufacturing solutions for module and enclosure, focusing on cost, volume manufacturability, yield, and quality. Collaborate with internal design, QA, reliability, supply chain, and external suppliers to qualify new equipment, technologies and assembly processes. Plan and establish engineering build requirements for new product introductions. Perform design reviews to ensure adherence to DFM guidelines and update design rules as required. Create and maintain mechanical design drawings, specifications, and 3D models using SolidWorks and AutoCAD. Generate technical documentation, including design reports, test reports, datasheets, and bills of materials. Develops, implements and maintains methods, operation sequence and processes in the assembly manufacturing. Maintains records such as yield report and reporting system for coordination of manufacturing operations. Drive improvement in terms of yield and cost saving. Interface with design engineering team in coordinating the release of new products. Responsible for documentation management and an understanding of good manufacturing practices. Uses appropriate tools and performs integrity analysis of packaging. Work with internal product design, QA, Reliability, Failure Analysis, supply chain, and the external suppliers to develop and qualify the appropriate packaging technologies and assembly processes, with focus on cost, high volume manufacturability, yield and quality Implement and improve robust assembly processes internally and at our contract manufacturers

Requirements

min. Bachelor Degree in Engineering.
1–5 years of experience in mechanical design, preferably in semiconductor or electronics packaging.
Mature, highly responsible, a good team player with good presentation skills
Fluent in spoken and written English. Must be US person
Strong analytical, problem-solving, and communication skills.
Expert in 2D AutoCAD and 3D SolidWorks (or similar CAD software).
3D printing for fast prototyping and design verification combined with good mech skills to build prototypes. (able to handle cutting laser and horizonal mill is a plus).
Ability to work independently and collaboratively in a fast-paced, result-oriented environment.
Knowledge of manufacturing technologies for packaging electronics, including machining metals, plastic injection molding, and additive manufacturing (3D printing).
Strong organizational skills and proficiency in Excel, Word, and PowerPoint.
Very good common of English, both oral and written

Nice To Haves

Familiarity with semiconductor assembly equipment (SMT, die attach, wire bonding, molding) is a plus.
Experience with SMT and PCB layout design and related software (e.g., Cadence) is a plus.
Experience with FEA tools (e.g. ANSYS) is a plus.
Knowledge of thermal management design for electronics is a plus.

Responsibilities

Support new product introductions from concept through production release, providing critical mechanical design input for RF power and photonics products.
Develop mechanical/manufacturing solutions for module and enclosure, focusing on cost, volume manufacturability, yield, and quality.
Collaborate with internal design, QA, reliability, supply chain, and external suppliers to qualify new equipment, technologies and assembly processes.
Plan and establish engineering build requirements for new product introductions.
Perform design reviews to ensure adherence to DFM guidelines and update design rules as required.
Create and maintain mechanical design drawings, specifications, and 3D models using SolidWorks and AutoCAD.
Generate technical documentation, including design reports, test reports, datasheets, and bills of materials.
Develops, implements and maintains methods, operation sequence and processes in the assembly manufacturing.
Maintains records such as yield report and reporting system for coordination of manufacturing operations.
Drive improvement in terms of yield and cost saving.
Interface with design engineering team in coordinating the release of new products.
Responsible for documentation management and an understanding of good manufacturing practices. Uses appropriate tools and performs integrity analysis of packaging.
Work with internal product design, QA, Reliability, Failure Analysis, supply chain, and the external suppliers to develop and qualify the appropriate packaging technologies and assembly processes, with focus on cost, high volume manufacturability, yield and quality
Implement and improve robust assembly processes internally and at our contract manufacturers