Lead Field Application Engineer

EKC Advanced Electronics USA•Sunnyvale, CA

About The Position

Are you looking to power the next leap in the exciting world of advanced electronics? Do you want to help solve problems that drive success in the rapidly evolving technology and connectivity landscape? Then bring your problem-solving, passion, and creativity to help us power the next leap in electronics. At Qnity , we’re more than a global leader in materials and solutions for advanced electronics and high-tech industries – we’re a tight-knit team that is motivated by new possibilities, and always up for a challenge. All our dedicated teams contribute to making cutting-edge technology possible. We value forward-thinking challengers, boundary-pushers, and diverse perspectives across all our departments, because we know we play a critical role in the world enabling faster progress for all. Learn how you can start or jumpstart your career with us. Qnity Electronics is seeking a highly skilled Lead Field Application Engineer to join our Technology team within the Advanced Flex Technologies (AFT) group in Sunnyvale, CA. This role is dedicated to developing advanced material solutions that enable business growth in high-speed, high-frequency, and power integrity electronic applications. The successful candidate will lead applications engineering for next-generation PCB and advanced packaging technologies, collaborating closely with OEM customers and internal teams to deliver solutions from concept through commercialization. The position emphasizes design and simulation work to integrate Qnity’s advanced materials into cutting-edge customer platforms.

Requirements

Ph.D. in Electrical Engineering or closely related field, and 10+ years of relevant experience in applications engineering, PCB design, or advanced packaging technologies preferred
M.Sc. in Electrical Engineering or closely related field, with 15+ years of relevant experience preferred
Demonstrated expertise in RF and signal integrity design, simulation, and characterization
Proficiency in tools such as Keysight ADS, HFSS, COMSOL, Polar Si9000, Sonnet, AutoCAD, MATLAB, LabVIEW, JMP
Strong analytical, communication, and interpersonal skills
Proven track record of successful customer engagement and project leadership
Experience with IPC standards and industry best practices
Able and willing to travel, typically up to 20%, as required.

Responsibilities

Lead applications development for Qnity’s advanced flex and rigid PCB materials.
Support AFT group initiatives by enabling material solutions that drive business growth.
Engage with OEM customers and the value chain in consumer electronics and data center sectors to define requirements and deliver design-phase solutions.
Collaborate closely with the business team to assess new opportunities and identify emerging technology trends.
Design, simulate, and characterize radio frequency (RF) and signal integrity (SI) test vehicles using industry-standard tools.
Partner with the leveraged RF/SI characterization team in Sunnyvale, providing technical leadership and guidance on characterization activities, including operation of VNAs (up to 120 GHz), TDRs, impedance analyzers, and RF probe stations.
Perform electromagnetic (EM) simulations using Keysight ADS, COMSOL, HFSS, Sonnet, and other modeling tools.
Develop and implement IPC-compliant characterization methodologies.
Partner with internal teams and external PCB fabricators to transition technologies from proof-of-concept to mass production.
Represent Qnity in industry consortiums and conferences.
Deliver technical training and seminars to internal teams and external partners.
Mentor junior engineers and contribute to their technical and professional development.