Intern - Wafer Thin Film Development (Vacuum Deposition) Summer 2026
About The Position
The HAMR Product Materials Group is responsible for delivering new material and deposition process solutions to Seagate's advanced recording head development effort. As part of the wafer process team, we develop best-in-class films using vacuum- and electrochemistry-based deposition methods, and partner with integration teams to introduce these films into new recording head designs. As an enabler of head performance and reliability advances through materials innovation, we help Seagate lead in technology and time-to-market. About the role - you will: Help develop novel metal thin films for next-generation heat-assisted magnetic recording (HAMR) heads Develop new vacuum-deposition and/or electrodeposition processes to achieve controlled nucleation and growth in platinum group/noble metal films Investigate structure-process-property relationships for polycrystalline and epitaxial films including detailed microstructural and physical property assessment Work with engineering staff to pattern and validate new films using wafer-level optical and transport test structures Perform work with team of PhD engineers in lab and clean room environments using different experimental techniques including sputtering, ion-beam deposition, plating, atomic layer deposition, XRD, ellipsometry, wafer curvature, adhesion testing, SEM/TEM, 4pt probe, etc.
Requirements
- You are self-motivated, able to work independently, and have excellent attention to detail.
- You are a team player capable of working in partnership with and communicating effectively with a diverse group of engineers and technicians.
- You are able to maintain thorough documentation of results and be able to clearly discuss them with other staff members in engineering forums.
- Graduate course work with hands-on experience in thin film deposition and characterization, with particular consideration given to backgrounds in metal materials, plasma physics, electrodeposition, nucleation and growth, microstructural evolution, and optical/transport/thermal property testing
- Knowledge of basic analysis and presentation software (Excel, Powerpoint, JMP…)
- Pursuing a PhD degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemistry, Physics, Applied Physics, or similar degree
Nice To Haves
- Prior experience in an industrial R&D environment is a plus
Responsibilities
- Help develop novel metal thin films for next-generation heat-assisted magnetic recording (HAMR) heads
- Develop new vacuum-deposition and/or electrodeposition processes to achieve controlled nucleation and growth in platinum group/noble metal films
- Investigate structure-process-property relationships for polycrystalline and epitaxial films including detailed microstructural and physical property assessment
- Work with engineering staff to pattern and validate new films using wafer-level optical and transport test structures
- Perform work with team of PhD engineers in lab and clean room environments using different experimental techniques including sputtering, ion-beam deposition, plating, atomic layer deposition, XRD, ellipsometry, wafer curvature, adhesion testing, SEM/TEM, 4pt probe, etc.
Benefits
- Seagate offers comprehensive benefits to its eligible Interns, including, but not limited to, medical, dental, vision, and participation in the employee stock purchase plan.
- Seagate also offers Interns 12 paid holidays and a minimum of 48 hours of paid sick leave.
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What This Job Offers
Career Level
Intern
Industry
Computer and Electronic Product Manufacturing
Education Level
Ph.D. or professional degree
Number of Employees
5,001-10,000 employees
