The Hardware Engineer, Principal designs, develops, and documents complex interconnect solutions for internal hardware needs as well as for customer hardware reference designs, identifies techniques and methodologies for modeling and measurement of devices and systems and actively participates in the evaluations of these. The interconnect solution may comprise multiple boards. The Hardware Engineer, Principal drives feasibility analyses at onset of PCB (printed circuit board) definition phase, evaluates and specifies electrical characteristics and performance of the PCB to determine compliance to appropriate regulating standards, and takes cradle-to-grave ownership of ownership of PCB according to requirements. Collects inputs from users of the PCB, including but not limited to, validation engineer, product engineer, IC design engineer, signal integrity engineer etc. Draft a BRD (Board Required Document) / Block Diagram to clearly define what is expected of the board & review it. Consults with designers, application engineers for component selection and circuit around the device under test. Designs complex circuits as required. Captures schematic using EDA tool such as xDxDesigner. Creates electrical symbols and layout footprints for new components. Creates Bill of Material (BOM). Maintains CAD library. Creates layout of the board using EDA tools such as Siemens PADS. Interacts with external vendors as necessary. Performs Power Integrity of assigned boards using PI Analysis tools such as HyperLynx Power Integrity. Perform Signal Integrity simulations and analysis of assigned boards using tools such as Ansys SiWave or HFSS. Collaborate with PCB layout engineers to optimize routing for high-speed signals. Develop and validate models for transmission lines, connectors, vias, and IC packages. Conduct pre- and post-layout SI analysis to ensure compliance with design specifications. Support design reviews and provide recommendations for signal integrity improvements. Work closely with cross-functional teams including electrical, mechanical, and firmware engineers. Perform lab measurements using oscilloscopes, VNAs, and TDRs to correlate with simulation results. Document analysis results and present findings to engineering leadership. Creates documentation for PCB fabrication and work with PCB vendors to resolve issues during manufacturing. Prepares Bonding Diagram for high-speed Optical interface and Chip on Board devices. Creates high-speed board design rules for automation and to speed up the Layout design time and effort. Organizes and drives board design reviews for assigned projects. Drives PCB verification and debug (board bring-up) covering both board functionality and performance. Provides mentorship to junior members of the team.
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Job Type
Full-time
Career Level
Principal
Education Level
Ph.D. or professional degree