ElectroMechanical Design Engineer Sr: MicroElectronics

Lockheed Martin•Orlando, FL

1d•Hybrid

About The Position

You will be the ElectroMechanical Design Engineer for the Advanced Electronics Packaging team at Lockheed Martin Missiles & Fire Control. Our team pioneers 2 D/3 D heterogeneous packaging concepts, integrating thin film, semiconductor and high performance thermal management technologies to create next generation electronic systems for aerospace and defense missions. What You Will Be Doing As the ElectroMechanical Design Engineer you will design, prototype and test cutting edge packaging solutions while collaborating with electrical, systems, test and product design engineers. You will work side by side with Lockheed Martin’s senior Advanced Packaging SME, gaining hands on experience with emerging semiconductor manufacturing processes and translating them into flight qualified hardware. Your responsibilities will include: Staying current with emerging semiconductor and packaging technologies and recommending new approaches for program adoption. Why Join Us Do you want to be part of a company culture that empowers employees to think big, lead with a growth mindset, and make the impossible a reality? We provide the resources and give you the flexibility to enable inspiration and focus. If you have the passion and courage to dream big, work hard, and have fun doing what you love then we want to build a better tomorrow with you. We offer flexible work schedules to comprehensive benefits investing in your future and security, Learn more about Lockheed Martin’s comprehensive benefits package here. Further Information About This Opportunity: This position is in Orlando. Discover more about our Orlando, Florida location. MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access. The selected candidate must be able to obtain a secret clearance. At Lockheed Martin, we use our passion for purposeful innovation to help keep people safe and solve the world's most complex challenges. Our people are some of the greatest minds in the industry and truly make Lockheed Martin a great place to work. With our employees as our priority, we provide diverse career opportunities designed to propel, develop, and boost agility. Our flexible schedules, competitive pay, and comprehensive benefits enable our employees to live a healthy, fulfilling life at and outside of work. We place an emphasis on empowering our employees by fostering an inclusive environment built upon integrity and corporate responsibility. If this sounds like a culture you connect with, you’re invited to apply for this role. Or, if you are unsure whether your experience aligns with the requirements of this position, we encourage you to search on Lockheed Martin Jobs , and apply for roles that align with your qualifications. Other Important Information By applying to this job, you are expressing interest in this position and could be considered for other career opportunities where similar skills and requirements have been identified as a match. Should this match be identified you may be contacted for this and future openings.

Requirements

DoD Secret level clearance or be able to obtain one.
Working knowledge of CREO and Windchill
Geometric Dimensioning and Tolerancing, and tolerance stack-up analysis
Packaging design experience
Hardware design experience
MUST BE A U.S. CITIZEN

Nice To Haves

Experience with Zuken E3 and Mentor CCA design and development
IDX File transfer
Flex design
Cable and harness design
Micro Electronics experience.

Responsibilities

Conceiving and modeling 2 D/3 D heterogeneous package architectures that meet size, weight, power and reliability targets.
Developing detailed mechanical and electrical designs for thin film interconnects, semiconductor dies, and advanced thermal management features.
Creating and executing test plans to validate electrical performance, thermal behavior and mechanical integrity of packaging prototypes.
Performing failure analysis and iterating designs based on test data, simulation results and manufacturing feedback.
Preparing comprehensive design documentation, including drawings, BOMs, specifications and verification reports.
Collaborating with cross functional teams (electrical, systems, test, product design) to ensure seamless integration of packaging solutions into larger systems.
Mentoring junior engineers and supporting the Advanced Packaging SME in knowledge transfer and technical guidance.
Staying current with emerging semiconductor and packaging technologies and recommending new approaches for program adoption.
Supporting technology readiness reviews and contributing to risk assessment activities for new packaging concepts.