ElectroMechanical Design Engineer: MicroElectronics

Lockheed Martin • Orlando, FL

1d • Hybrid

About The Position

You will be the ElectroMechanical Design Engineer for the Advanced Electronics Packaging team at Lockheed Martin Missiles & Fire Control. Our team pioneers 2 D/3 D heterogeneous packaging concepts, integrating thin film, semiconductor and high performance thermal management technologies to create next generation electronic systems for aerospace and defense missions. What You Will Be Doing As the ElectroMechanical Design Engineer you will be responsible for architecting, designing and validating advanced circuit card packages that support ASIC, System on Chip (SoC) and Multi Chip Package (MCP) solutions. You will work closely with circuit design engineers, systems engineers and test specialists to turn requirements into reliable hardware while leading design assurance reviews and ensuring seamless integration of cables and interconnects.

Requirements

• Experience with cable harness concepts for subsystem interfaces, generating wiring diagram
• Experience in circuit card assembly (CCA) / printed wiring board (PWB) design
• Familiarity with high-speed applications and PWB constraints
• Experience capturing flowed and derived requirements for electromechanical designs
• MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access. The selected candidate must be able to obtain a secret clearance.

Nice To Haves

• Familiarity with SOC / MCP solutions and ASIC verification and validation testing needs at the circuit card level
• Experience with parts and materials selections
• Ability to perform design trade studies; evaluating cost, weight, packaging, power benefits
• Familiarity with CAMEO
• Experience with flex circuit design
• Micro Electronics design experience.

Responsibilities

• Collaborating with circuit design engineers to capture requirements and define packaging concepts for early prototype ASIC testing.
• Designing high density circuit cards, cable assemblies and interconnect solutions that meet size, weight, power, security and performance constraints.
• Creating detailed mechanical layouts, 3 D models and 2 D schematics using industry standard CAD tools.
• Developing and executing verification and validation test plans for SoC, MCP and ASIC devices at the circuit card level.
• Leading and documenting design assurance reviews, tracking issues and driving corrective actions to closure.
• Performing thermal, signal integrity and electromagnetic compatibility analyses to ensure robust operation in harsh DoD environments.
• Generating comprehensive design documentation, bill of materials, test reports and configuration records in Lockheed Martin PLM tools.
• Mentoring junior engineers and sharing best practices across the packaging team.
• Communicating technical status, risks and recommendations clearly to internal stakeholders and external customers.
• Traveling as needed to supplier sites, test facilities or program milestones to support prototype validation.

Benefits

• We offer flexible work schedules to comprehensive benefits investing in your future and security, Learn more about Lockheed Martin’s comprehensive benefits package here.
• Medical, Dental, Vision, Life Insurance, Short-Term Disability, Long-Term Disability, 401(k) match, Flexible Spending Accounts, EAP, Education Assistance, Parental Leave, Paid time off, and Holidays.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Education Level: No Education Listed
• Number of Employees: 5,001-10,000 employees