Dry Etch Process Development Engineer

Micron Technology•Boise, ID

About The Position

Conduct plasma etch process characterization, optimization, design, troubleshooting, process transfer, and fundamental research. Carry out the R&D Pilot Line Fab, and updating the Fab engineers on customer issues and technology needs. Supporting root cause defect and unique fail mode analysis. Conduct process Integration, including the delivery of advanced technology to meet future product nodes; development of recipes to meet structural & electrical requirements; and the management of wafers though Dry Etch levels in support of special requirements. Work in cross-functional teams to develop device structures. Supporting multi-functional failure analysis and yield improvement.

Requirements

MS/PhD or BS + 5 years in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Chemistry, Physics or related technical discipline
Understanding one of the following: Transport phenomena, Electromagnetics, Atomic/Molecular physics, Surface phenomena
Solid trouble shooting, experimental design and data analysis skills
Firm understanding of principles of dry etch processing
Experience with process control and Statistical Process Control (SPC)
Understanding solid-state devices and semiconductor processes
Indepth understanding of semiconductor process areas
Mechanistic understanding of the relationships between structural metrics and process parameter changes
Ability to resolve complex integration issues through process development
Ability to guide strategic directions for your process area of expertise
Experience driving the roadmap for the processes you own