Chip Engineer #ESF9263

ExpertHiring•San Jose, CA

7d•Onsite

About The Position

The Chip Engineer will be responsible for owning and developing Die Attach and Flip Chip assembly processes from end-to-end. This role involves driving process development, optimization, and yield improvement, aiming for approximately 95% yield. The engineer will operate in a high-mix, low-volume environment, managing multiple projects concurrently. Key tasks include designing and executing Design of Experiments (DOE) for New Product Introductions (NPI), analyzing yield issues, and implementing process improvements on the production line. Collaboration with cross-functional teams such as Sales, Operations, Quality, and Engineering is essential. The position also requires supporting Request for Quotes (RFQs) with process inputs and technical feasibility, and training technicians and operators on new processes and quality standards. There will be opportunities to contribute to advanced photonics and active alignment assembly, with training provided, and to work with or learn advanced tools like die bonders, pick-and-place, and alignment systems.

Requirements

2+ years of hands-on experience in Die Attach and Flip Chip process development
Proven ability to develop and optimize processes with high yield (~95%)
Experience in semiconductor packaging or related micro-assembly (RF, MEMS, etc.)
Strong understanding of DOE, SPC, and yield improvement methodologies
Ability to multi-task in a fast-paced, high-mix environment
Exposure to equipment like ESEC/Evo, Hesse, Amicra, FineTech, Disco, ficonTEC (or similar)
Basic to intermediate exposure to software/tools (SolidWorks, MATLAB, Python, LabVIEW)
Bachelor’s degree in Engineering or related field
Hands-on Die Attach (DA) & Flip Chip (FC) process development
Strong yield improvement (SPC, DOE) experience
Ability to work in high-mix, low-volume environment
Multi-project handling & fast learning ability
Strong ownership mindset & commitment

Nice To Haves

Photonics / Optoelectronics exposure or coursework
Experience with active alignment systems
Familiarity with advanced assembly equipment (Evo, Hesse, Amiga, FineTech, Disco, ficonTEC)
Exposure to micro-assembly (RF, MEMS, optics)
Programming/tools: Python, MATLAB, LabVIEW, SolidWorks

Responsibilities

Own and develop Die Attach and Flip Chip assembly processes end-to-end
Drive process development, optimization, and yield improvement (~95%)
Work in a high-mix, low-volume environment, managing multiple projects simultaneously
Design and execute DOE (Design of Experiments) for new product introductions (NPI)
Analyze yield issues and implement process improvements on the production line
Collaborate with cross-functional teams (Sales, Ops, Quality, Engineering)
Support RFQs with process inputs and technical feasibility
Train technicians and operators on new processes and quality standards
Contribute to advanced photonics and active alignment assembly (training provided)
Work with or learn advanced tools like die bonders, pick-and-place, alignment systems