Advanced Packaging TD Plating Module Engineer

Intel Corporation • Aloha, OR

8d • Onsite

About The Position

As a Module Development Engineer, you will be at the forefront of Intel's advanced packaging technology development, driving both high-volume manufacturing and the enablement of future technologies. In this role, you will lead the plating process development, optimize equipment solutions, material & chemical selection, and perform feasibility studies to meet device specifications. Your work will directly contribute to Intel's innovation in technology roadmaps, enabling cutting-edge device architecture and advancing semiconductor manufacturing capabilities. By collaborating with cross-functional teams and external suppliers, you will ensure the creation of robust, scalable solutions that position Intel as a leader in the semiconductor industry.

Requirements

• Master’s degree with 6+ years of relevant experience, or PhD with 4+ years of experience in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Chemistry, Physics, or a related STEM discipline.
• 3+ years of experience in Electrochemical Plating processing, fab process development, and/or advanced packaging technology.
• Advanced knowledge in process development methodology, statistical process control, research and development, and manufacturing process improvement.

Nice To Haves

• Experience in advanced packaging, RDL-based packaging, or ultra-fine pitch solder connections.
• Proven track record in leading programs from strategy formation through high-volume production and sustaining.
• Recognized technical leadership and capability to develop solutions to complex engineering problems.
• Strong collaboration skills with decision-makers across various functional areas such as yield and operations.

Responsibilities

• Drive technology development and enablement for current and future nodes for electroplating needs.
• Lead and drive advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.
• Design, execute and analyze experiments to improve electroplating process.
• Develop technology roadmaps to guide future manufacturing needs and push industry standards forward.
• Collaborate with equipment and material suppliers to design and implement innovative process technologies.
• Closely engage with equipment and chem suppliers for better process outcomes.
• Optimize production efficiency and manufacturing techniques, while improving output for existing products.
• Utilize data analytics and statistical methods to provide insights for continuous process improvements.
• Identify and implement modifications for equipments to enhance operational efficiency.
• Lead path-finding activities and innovative process development to enable new device architectures.

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Education Level: Ph.D. or professional degree