Are you ready to see your career take flight? At GE Aerospace, we believe the world works better when it flies. We are a world-leading provider of jet engines, components, and integrated systems for commercial and military aircraft. We have a relentless dedication to the future of safe and more sustainable flight and believe in our talented people to make it happen. The Advanced Lead – SiC/GaN Power Module Packaging Engineer will focus on the design of power modules along with development, optimization, and implementation of manufacturing processes for both GaN and SiC power modules. These advanced semiconductor power modules are critical for high-efficiency high power density power electronics. In this role, you will be responsible for developing, optimizing, and implementing manufacturing processes for existing and new Gallium Nitride (GaN) and Silicon Carbide (SiC) power modules. You will participate in power module design and simulation analyses, and will work closely with mechanical designers, quality, and production teams to ensure the efficient and reliable production of high-performance GaN and SiC power modules. In addition, you will be involved in troubleshooting, process improvement, and ensuring compliance with industry standards and safety regulations. GE Aerospace, based in Pompano Beach, is a global powerhouse in the aviation industry, specializing in cutting-edge aircraft engines, systems, and avionics. The Advanced Technology Organization is responsible for driving growth through technology by researching customer needs both met and unmet, then finding solutions. Our team supports both military and commercial customers in land, sea, and air domains.
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Job Type
Full-time
Career Level
Mid Level
Number of Employees
5,001-10,000 employees