Packaging Module Process Development Engineer

Intel Corporation • Chandler, AZ

1d • Onsite

About The Position

Intel's Advanced Packaging Technology Manufacturing (APTM) group is a critical division focused on next-generation semiconductor packaging solutions. Primary Focus: Advanced semiconductor packaging technologies beyond traditional methods 3D packaging solutions and chiplet integration High-performance computing packaging for data centers and AI Heterogeneous integration of different chip technologies Scaling packaging density while improving thermal and electrical performance Key Objectives: Enable Moore's Law continuation through advanced packaging Reduce system-level power consumption and improve performance Support Intel's IDM 2.0 strategy and foundry services Develop packaging solutions for emerging workloads (AI, edge computing) Packaging Module Equipment Development Engineer responsibilities include but are not limited to: Develops assembly processes and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers. Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows. Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods. Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability. Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms. Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods. Provides consultation concerning packaging problems and improvements in the packaging process and responds to customer/client requests or events as they occur. Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones.

Requirements

• The candidate must have bachelor’s degree in engineering, physics, chemistry or related STEM field with 5+ years of industry experience.
• 6+ months of experience with statistical controls
• 6+ months of experience FMEA and/or DOE
• 6+ months of semiconductor fabrication related experience

Nice To Haves

• Master’s degree in engineering, physics, chemistry or related STEM field with 4+ years of industry experience.
• Ph.D. degree in engineering, physics, chemistry or related field with 2+ years of industry experience
• Preference for experience with dispense and/or material development.
• Product ownership, change control management and data systems
• Project management and delivering results for time critical technical projects.
• Technical innovation and deliver results for complex, time critical technical projects.
• Excellent verbal and written communication skills.
• Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Responsibilities

• Develops assembly processes and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies.
• Optimizes and improves the efficiency of manufacturing of packages, developing processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
• Develops process and equipment specifications applying principles for design of experiments and data analysis, and documents improvements through white papers.
• Ensures manufacturability of physical layout of package design and oversees the cycle of manufactured package processes, procedures and flows.
• Establishes material specifications for contract assemblers and raw material vendors and interfaces with supplier quality and procurement teams to ensure material quality and vendor performance requirements are met through strict adherence to process specifications and existing product qualification methods.
• Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with packaging quality and reliability.
• Sets reliability requirements to meet customer needs and influences design, material selection and process development to meet those needs, based on fundamental understanding of failure mechanisms.
• Leads efforts towards innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods.
• Provides consultation concerning packaging problems and improvements in the packaging process and responds to customer/client requests or events as they occur.
• Delivers standardization in product qualification, manufacturing quality systems, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones.

Benefits

• We offer a total compensation package that ranks among the best in the industry.
• It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level