Packaging Engineer - Inductor and Power Module

Texas Instruments

20h

About The Position

Change the world. Love your job. The Emerging Packaging and Test Team at Texas Instruments is looking for a Magnetics and Passives Integration Technologist. As a member of our packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization. Responsibilities may include: Lead the definition, development and realization of comprehensive low-profile inductors, planar magnetics, and integrated passives roadmaps to enable ultra-compact, high-density, high current (100-300A) power delivery modules for enterprise and AI infrastructure. Develop strategic relationships and partnerships with leading suppliers worldwide to co-develop magnetic materials, inductors, capacitors, and packaging technologies that meet performance, reliability, and scaling needs. Ensure manufacturability, testability and reliability through early-stage DfX, material qualification, and close supplier collaboration. The candidate must be a proven leader, capable of working collaboratively across worldwide cross functional teams and accelerating development cycles to meet aggressive time-to market targets.

Requirements

• MS in Electrical Engineering, Materials Science, or a related field with deep focus on magnetics and power packaging
• 10+ years of hands-on experience in power inductor design supporting advanced power topologies, including TLVR & multiphase coupled inductors (upto 20MHz) with a track record of joint development, qualification, and scaling
• Strong fundamentals in the physics of magnetic materials: ex. Stoner-Wohlfarth, Steinmetz models, Ollendorf models for composite materials, etc.
• Experience with Material Characterization (ex; BH analyzer, VSM, SEM, EDX)
• Experience in advanced co-packaged power modules
• Strong IP generation background in magnetics, packaging, or passive integration domains

Nice To Haves

• PhD in Electrical Engineering, Materials Science, or a related field with deep focus on magnetics and power packaging
• System-level understanding of power delivery architectures, thermal management, EMI, and reliability constraints
• In depth understanding of magnetic materials: Ferrite materials (NiZn MnZn), metal materials (Fe, FeNi, FeSiCr, FeSiAl, amorphous & nano crystalline materials)
• Familiarity with high-frequency magnetic material behavior, loss modeling, and reliability testing.
• Hands on knowledge of simulation tools and techniques like Maxwell, Ansys, Femtet, homogenization and model order reduction, optimization tools (NN, AI/ML)
• Understanding of material processing: ceramic, metal powder and composite materials
• Familiarity with inductor coil forming and termination processes: wire wounded, multilayer, metal composite, thin film, etc.
• Deep insights in magnetic supplier capabilities, roadmaps and emerging research

Responsibilities

• Lead the definition, development and realization of comprehensive low-profile inductors, planar magnetics, and integrated passives roadmaps to enable ultra-compact, high-density, high current (100-300A) power delivery modules for enterprise and AI infrastructure.
• Develop strategic relationships and partnerships with leading suppliers worldwide to co-develop magnetic materials, inductors, capacitors, and packaging technologies that meet performance, reliability, and scaling needs.
• Ensure manufacturability, testability and reliability through early-stage DfX, material qualification, and close supplier collaboration.
• The candidate must be a proven leader, capable of working collaboratively across worldwide cross functional teams and accelerating development cycles to meet aggressive time-to market targets.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level