Packaging Module Development Engineer

Intel Corporation • Chandler, AZ

1d • Onsite

About The Position

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing. As a Packaging Module Development Engineer, you will. • Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future packaging platforms. • Collaborate with multifunctional, cross organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability. • Drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities • Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high volume manufacturing. • Manage projects to ensure alignment with product development schedules and execution milestones. • Apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges. • Provide sustaining engineering support to maintain equipment performance and process health in high volume manufacturing environments • Respond effectively and with urgency to foundry customer requests, escalations, and manufacturing events The ideal candidate will demonstrate: • Technical leadership, strategic planning, and critical thinking. • Ability to coach and develop technical teams. • Tolerance for ambiguity and adaptability in a dynamic environment. • Flexibility in managing changing priorities and responsibilities. • Experience leading teams in a highly matrixed organization. • Initiative and ability to work independently. • Strong communication, influencing, technical, and analytical skills. This position requires regular onsite presence.

Requirements

• Master's degree in engineering, physics, chemistry or related STEM field with 3+ years of industry experience or PhD with one or more years in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field.
• Minimum cumulative GPA of 3.5.
• Must have the required degree prior to your start date.
• Experience in programming/script (e.g., Python, MATLAB) development with artificial intelligence and machine learning concepts

Nice To Haves

• One or more years of experience in one or more of the following areas:
• Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE)
• Delivery of results for complex, time-critical technical projects.
• Semiconductor fabrication processes and technologies.
• Prior related work experience within a semiconductor foundry.

Responsibilities

• Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future packaging platforms.
• Collaborate with multifunctional, cross organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities
• Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high volume manufacturing.
• Manage projects to ensure alignment with product development schedules and execution milestones.
• Apply sound engineering principles, formal education, and professional judgment to resolve complex technical challenges.
• Provide sustaining engineering support to maintain equipment performance and process health in high volume manufacturing environments
• Respond effectively and with urgency to foundry customer requests, escalations, and manufacturing events

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as benefit programs which include health, retirement, and vacation.
• Find more information about all of our Amazing Benefits here.
• Intel Benefits: https://www.intel.com/content/www/us/en/jobs/benefits.html
• Life Inside Intel: https://www.intel.com/content/www/us/en/jobs/life-at-intel.html
• Interviewing Tips: https://www.intel.com/content/www/us/en/jobs/hiring.html
• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel.

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level