Wirebond Operator
About The Position
Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today's innovators stay Ahead of What's Possible™. Learn more at www.analog.com and on LinkedIn and Twitter (X). Analog Devices Inc., Chelmsford, MA is looking for a Wirebond Operator to support our continued growth in the manufacture of high-performance microwave modules and sub-systems. Customers trust Analog Devices to deliver integrated electronics, and ADI is interested in energetic and organized team players that want to deliver quality products in a high-tech manufacturing environment. This is a hands-on position that requires a strong ability to work on delicate parts utilizing a microscope.
Requirements
- US Citizenship and able/willing to obtain a government security clearance.
- High school diploma/GED required.
- 2-3 Years of RF/DC gold wire and ribbon bonding using manual, semi-manual, semi-automatic & automatic equipment experience, familiarity with microelectronics assembly processes
- Ability to follow both verbal and written instructions/documentation.
- For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.
Nice To Haves
- A diploma from a Vocational High School or Technical Diploma is a plus.
Responsibilities
- Automated and manual wedge and ball bonding (F&K, Hesse, manual bonders)
- Bond pull/shear testing and rework (Dage testers)
- Die shear/stud pull testing
- Plasma and solvent cleaning technologies
- Ability to work 8 hours under the microscope utilizing miniaturized hand tools such as tweezers and fine screwdrivers.
- In-process inspection and self-inspection.
- Good computer skills are required to support retrieval of drawings and work instructions, as well as other job activities.
- Ability to read and work from detailed process sheets, prints and drawings.
- Ability to follow both written and verbal instructions.
- Hand assembly using a variety of tools and or equipment according to specifications/process
- Handle of ESD sensitive material and equipment
- Willing to be cross-trained and perform other related duties as required.
- Demonstrate a keen awareness of safety practices and familiarity with OSHA standards.
Benefits
- This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.
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What This Job Offers
Job Type
Full-time
Career Level
Entry Level
Education Level
High school or GED
