Wafer Packaging Manufacturing (WPM) is a worldwide factory network specializing in the processing and testing of product as interconnects are made and wafers are transformed into die. The WPM organization is part of APTM (Advanced Packaging Technology and Manufacturing) within Intel Foundry. This organization includes process segments and factories for FBE/C4 (RDLs/Passivation/Bumping), Wafer Level Assembly (WLA), Hybrid Bond Interconnect (HBI), Die Prep, Die Sort, E-Test, and Wafer Sort. The team processes both traditional and advanced packaging products and is responsible for high volume manufacturing with high quality of Intel Products and Foundry Services products. WPM collaborates with upstream factories (TFSM and External companies) and downstream factories (ATM and External OSATs) within the overall supply chain, as well as many other Intel organizations. The goal is to be world-class in their process segment while providing fulfilling careers in an inclusive and learning environment. The WPM US/Europe Wafer Sort and Die Sort Factory Manager will lead the Sort factories in the US and Europe regions, with the Sort teams in these regions reporting to this manager. Current operations are in Oregon, New Mexico, Ireland, and Israel. This role reports directly to the WPM General Manager and is a member of WPM Staff. The manager is responsible for E-Test, Wafer Sort, and Die Sort for both internal and external wafers in the Europe and US regions.
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Job Type
Full-time
Career Level
Senior
Number of Employees
5,001-10,000 employees