2026 Undergrad ASIC Package Engineering Intern/Co-Op
About The Position
At AMD, our mission is to build great products that accelerate next-generation computing experiences-from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you'll discover the real differentiator is our culture. We push the limits of innovation to solve the world's most important challenges-striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. As an AMD intern or co-op, you'll be placed at the epicenter of the AI ecosystem, working alongside experts and industry pioneers. You'll do important work, learn new skills, expand your network, and gain real-world experience on projects that impact millions of end-users worldwide. Whether you're an undergrad or a PhD student, your contributions matter-and your experience here will be a launchpad for what comes next. We are seeking a highly motivated ASIC Package Engineering intern/co-op to join our team and work with our team of engineers in bringing new and advanced packaging technology to reality. In this role -
Requirements
- You are currently enrolled in a United States based University in a Bachelor's program majoring in Electrical engineering, Engineering Science, Computer Engineering, Mechanical Engineering, Material Science Engineering, or a related field
- Course related to transmission lines and electric circuits
- Package, silicon or PCB design software
- Scripting languages - Perl / Python / SQL
- Semiconductor theory and packaging process/technolog.
- Data analytics and data visualization tools like powerBI
Responsibilities
- supporting Package design and Package Development Engineers in prioritizing and optimizing new projects
- complete substrate, interposer and bump designs for AMD products, test vehicles and probe card substrates
- projects related to design verification implementation to ensure design performance, quality and efficiency
- Analyzing yield and defect metrics to ensure design performance and help improve the yield
- evaluate, benchmark packaging materials and interact with partners to achieve the most cost-efficient design and materials for the best performance and yield requirements
Benefits
- AMD benefits at a glance.
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What This Job Offers
Job Type
Full-time
Career Level
Intern
Industry
Computer and Electronic Product Manufacturing
Number of Employees
5,001-10,000 employees
