Thin Film Process Development Engineer Intern - Summer 2026
About The Position
This intern will work with Process Development Engineers on the Reader Development Team to assist with process and materials characterization. The project will involve researching, developing, and characterizing dielectric and magnetic materials and materials processes for next generation thin film recording heads. Specific projects will be determined when the summer begins, but could include any of the following: Evaluation of stress and breakdown voltage of new dielectric materials. Evaluation of interactions between reader stack cap materials and the reader formation processes including ion mill, icp etch, and sputter etch. Optimization of deposition conditions for new magnetic shield materials, including magnetic and electrical performance characterization. Materials characterization and process optimization for the reader magnetic layers and non-magnetic cap.
Requirements
- Work effectively within both small and large teams, while taking initiative and executing on independent tasks to generate results.
- Familiarity and experience with thin film dielectric processing and characterization is critical.
- Talented engineer with a broad engineering background, a deeper understanding of vacuum deposition and etch processing.
- Learn quickly and adapt to changing priorities.
- Communication of results and issues effectively within our team, as well as collaborating well with other support, process and design groups is particularly important.
- Pursuing an MS or PhD in Science or Engineering (Physics, Material Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Chemistry) and will be returning to school in Fall 2026.
- Thin film deposition using any of PVD, CVD, Evaporation
- Structural characterization using XRR/XRD
- Residual stress characterization
- Dielectric properties characterization like refractive index, breakdown voltage, dielectric constant
- Magnetic property characterization
Responsibilities
- Evaluation of stress and breakdown voltage of new dielectric materials.
- Evaluation of interactions between reader stack cap materials and the reader formation processes including ion mill, icp etch, and sputter etch.
- Optimization of deposition conditions for new magnetic shield materials, including magnetic and electrical performance characterization.
- Materials characterization and process optimization for the reader magnetic layers and non-magnetic cap.
Benefits
- Seagate offers comprehensive benefits to its eligible Interns, including, but not limited to, medical, dental, vision, and participation in the employee stock purchase plan. Seagate also offers Interns 12 paid holidays and a minimum of 48 hours of paid sick leave.
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What This Job Offers
Career Level
Intern
Industry
Computer and Electronic Product Manufacturing
Number of Employees
5,001-10,000 employees
