Technologist, Hardware Development Engineering

Western Digital•Fremont, CA

About The Position

Chemical Mechanical Planarization (CMP) Process Development is part of the Wafer Wet Process Development. The Technologist, Hardware Development Engineering will be responsible to develop new CMP process and technology, enable and accelerate technology deployment into head products to meet HDD requirements through product life cycle. Partner with wafer wet process development engineers and technicians responsible for CMP new process development, methodology setup, consumables, and advance tooling delivery to meet new product launch requirement, schedule, and manufacturability. Work with cross functional teams including design, integration, and other development process modules on designs incorporating CMP or resolving any integration issue. Lead on trouble-shoot the related issues in development line, conduct defect analyses, root cause analyses, and implement corrective and preventive actions. Responsible for new process to manufacturing engineering (ME) transferring, support ME team on necessary process implementing and manufacturing ramping. Apply quantitative analysis and novel machine learning technology for wafer wet process module data analysis. Build statistically solutions to provide feedback guidance to improve process development performance.

Requirements

PhD degree in physics, chemistry, chemical engineering, materials science, or a related engineering field.
At least 5 year of knowledge / working experience on CMP process development, and post cleaning processes.
Understanding other process techniques, such as photolithography, dry or wet etching, electroplating, or thin film deposition processes,
Excellent communication skills, both written and oral.
Able to work on the resolution of any issue and to interact with various interdepartmental team and support organizations.
Demonstrated leadership and project driving skills, capable of managing team and projects with set milestones and timeline, and ability to execute.

Nice To Haves

Experience in wafer-level magnetic recording head fabrication and integration are desirable.
Experience with statistical analysis tools, such as JMP, is a plus.

Responsibilities

Develop new CMP process and technology.
Enable and accelerate technology deployment into head products to meet HDD requirements through product life cycle.
Partner with wafer wet process development engineers and technicians responsible for CMP new process development, methodology setup, consumables, and advance tooling delivery to meet new product launch requirement, schedule, and manufacturability.
Work with cross functional teams including design, integration, and other development process modules on designs incorporating CMP or resolving any integration issue.
Lead on trouble-shoot the related issues in development line, conduct defect analyses, root cause analyses, and implement corrective and preventive actions.
Responsible for new process to manufacturing engineering (ME) transferring, support ME team on necessary process implementing and manufacturing ramping.
Apply quantitative analysis and novel machine learning technology for wafer wet process module data analysis.
Build statistically solutions to provide feedback guidance to improve process development performance.

Benefits

paid vacation time
paid sick leave
medical/dental/vision insurance
life, accident and disability insurance
tax-advantaged flexible spending and health savings accounts
employee assistance program
other voluntary benefit programs such as supplemental life and AD&D, legal plan, pet insurance, critical illness, accident and hospital indemnity
tuition reimbursement
transit
the Applause Program
employee stock purchase plan
the Western Digital Savings 401(k) Plan