Technical Package Product Manager & Member of Technical Staff

Micron Technology • San Jose, CA

20d

About The Position

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In the role of a Technical Package Product Manager & Member of Technical Staff at Micron, you will be at the forefront of innovation in memory package development! Your expertise will be essential in developing the next generations of advanced DRAM product solutions for datacenter providers! Your responsibilities include collaborating with customers on their IC package product requirements and solutions; defining test vehicles to deliver the vital advanced IC package design rules, new materials and integrations; and providing consultation on IC package design, thermal, electrical, mechanical, reliability, and cost considerations. You will work with a diverse multi-functional team in Micron. Your role will contribute to the alignment between product market development, die and IC package design, and chip to package interactions, ensuring they are seamlessly integrated with assembly, testing, manufacturing, and global quality standards. This role offers the unique opportunity to engage with senior executives in shaping the development of groundbreaking IC packaging technologies.

Requirements

• Proven leadership in leading multi-functional teams to achieve timely technical goals while maintaining a high standard of excellence.
• A keen understanding of IC packaged product solutions (TSV, Discrete, PoP, FOP, InFo, MEP) and the system integrations used in the top datacenter makers in US.
• Excellent English interpersonal skills.
• Familiarity with datacenter company cultures.
• Skilled in interpreting sophisticated design and simulation data across multiple engineering domains.
• Bachelor’s degree in physics, Materials Science, Mechanical Engineering, Chemical Engineering, or Electrical Engineering; advanced degrees (MS, PhD) are preferred.
• 10+ years of proven experience in related fields.
• Documented record of technical expertise and innovation resulting in high impact results; publications, patents; and track record of technical leadership and mentoring.

Responsibilities

• Engaging datacenter and business partners in systems requirements for end application and translating into package product technical requirements' definition (thermal, mechanical, reliability and aspects of electrical).
• Defining memory package design rule roadmap for wirebond and TSV stacked memory applications. Including rules to achieve reliability requirements, Chip-Package-Interaction (CPI), substrate design, die stacking and materials.
• Leading a design and development team for test vehicle definition and execution to achieve roadmap requirements and validation ahead of go-to-market product timelines.
• Leading a multi-functional design and development team to achieve revenue package products on schedule by influencing design attributes, materials selection, die fit studies, cost analysis and reliability requirements.
• Collaborating with Business, Product Engineering and field teams to guide package products from concept to mass production.

Benefits

• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time-off program and paid holidays.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level