Technical Director, NPI Packaging Technology and Assembly Engineering
About The Position
The Technical Director, NPI Packaging Technology and Assembly Engineering will lead a small but broad team of engineers and work with RFIC design teams to develop, design, and implement pSemi world-wide packaging, assembly, and prototype manufacturing processes. Additional responsibilities include competitive benchmarking, technology roadmap generation, feasibility studies, packaging cost analysis, risk assessment, product packaging specification for pSemi NPI projects, and PCB layout. This person will work hand in hand with RFIC design teams and the operations group to bring cutting edge wireless products to market. This position will report directly to the Sr. Director, RFFE Product engineering.
Requirements
- Minimum of 15 years of experience in semiconductor packaging and assembly process development
- 8 years of management experience
- Strong written and verbal communication skills
- Ability to manage multiple complex, high visibility projects in parallel
- Expertise with assembly process development, characterization and qualification for advanced high volume manufacturing processes
- Experience with wafer bumping, singulation, wirebond and flip chip assembly, organic laminate and ceramic substrate technology, Wafer Level CSP (WLCSP), System in Package (SIP), embedded die technology, and lead frame packaging
- Experience with package design tools such as Autocad, Cadence Allegro / APD, Zuken
- Experience generating assembly and package drawings for vendors, customers, and data sheets
- Knowledgeable about package electrical / thermal / stress modeling and characterization
- Knowledgeable about RF and power dissipation as it relates to packaging requirements
- Experience generating customer application notes and supporting RMA investigations
Nice To Haves
- Strong working knowledge and experience working with Asian subcontract bump and assembly suppliers
- Familiarity with EM concepts and techniques for optimizing impedances, ground inductances, and isolation
- Familiarity with EMI concepts and modeling techniques
- Demonstrated ability to use statistical analysis tools (such as JMP) and concepts, including proficiency in formal Design of Experiment methodology applied to process development
Responsibilities
- Lead and manage small teams of packaging and layout engineers
- Develop a package and assembly roadmap to meet pSemi business unit goals in collaboration with the operations packaging team
- Lead and collaborate with Design & Operations to develop differentiating packaging standards and flows
- Work closely with the IC design teams on pSemi NPI project package technology, package design, and package selection
- Work with the EM and layout teams to enable standards and drive best practices across the company
- Work collaboratively as required with Operations for vendor & technology selection, cost analysis, qualification, production ramp, and RMA investigation of bumped and packaged products manufactured at pSemi off-shore assembly subcontractors
- Advise management on roadmap for new suppliers to meet pSemi Business Unit and Operations team goals
- Drive continuous improvement in design for cost and more aggressive design rule implementation
- Participate in technical audits of vendors and subcontractors in collaboration with Operations
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What This Job Offers
Job Type
Full-time
Career Level
Manager
Number of Employees
51-100 employees
