System in Package R&D Assembly Intern
About The Position
Keysight is on the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do. Our award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers. As an R&D Intern at Keysight Technologies, you will apply knowledge and skills developed through graduate-level coursework and research to help advance the next generation of compound semiconductor IC architecture and heterogeneous integration. This role offers deep exposure to real-world product development in a high-mix, high-performance manufacturing environment, working alongside experienced engineers on technologies that directly impact Keysight’s industry-leading products. Your research and development efforts will focus on advanced microelectronics assembly and integration processes, including pick-and-place, thermo-compression bonding (TCB), wafer separation, and surface-mount assembly. You will also contribute to continuous improvement of existing production processes through application of lean manufacturing principles, statistical process control (SPC), and root cause corrective action methodologies. Throughout the internship, you will gain hands-on experience with Keysight’s products, infrastructure, and manufacturing systems, while developing practical skills in process development, data-driven decision making, and cross-functional collaboration. This is an opportunity to translate academic research into manufacturable solutions at a company recognized as a leader in the markets it serves. Key Responsibilities Support R&D and process development activities for advanced semiconductor packaging and heterogeneous integration Execute hands-on laboratory work related to compound semiconductor and microelectronics assembly processes Analyze process data using SPC and DOE methodologies to improve yield, throughput, and process robustness Participate in failure analysis, root cause investigations, and corrective action implementation Document experimental results and present findings to engineering and cross-functional stakeholders Internship Duration Flexible duration of 3–6+ months, based on availability and project needs
Requirements
- Currently pursuing a BS, MS or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field
- Demonstrated experience or coursework related to advanced microelectronics or semiconductor processes (required)
- Hands-on lab experience with semiconductor fabrication or assembly processes such as: Surface Mount technology System in Package Heterogeneous Assembly Electroplating Wafer thinning, dicing, or die sort
- Experience with statistical process control (SPC) and design of experiments (DOE) is highly valued
- Strong analytical, problem-solving, and communication skills
- Ability to work effectively in cross-functional environments (working with operations staff, engineers, managers and other supporting functions)
- Highly motivated, self-directed, and capable of working in fast paced environment
- Candidates must be currently enrolled in an accredited college or university as of September 2026. Applicants who have graduated prior to September 2026 will not be considered unless they are enrolling in an MS or PhD program following graduation.
Nice To Haves
- Experience with III-V compound semiconductor processing strongly preferred
- Experience with statistical process control (SPC) and design of experiments (DOE) is highly valued
Responsibilities
- Support R&D and process development activities for advanced semiconductor packaging and heterogeneous integration
- Execute hands-on laboratory work related to compound semiconductor and microelectronics assembly processes
- Analyze process data using SPC and DOE methodologies to improve yield, throughput, and process robustness
- Participate in failure analysis, root cause investigations, and corrective action implementation
- Document experimental results and present findings to engineering and cross-functional stakeholders
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What This Job Offers
Career Level
Intern
Number of Employees
5,001-10,000 employees
