STTD Test Engineer Intern

Intel Corporation • Chandler, AZ

1d • Onsite

About The Position

The STTD Module Development Team is seeking a highly motivated Test Engineer Intern to support next generation server and client technology development. This role offers hands on experience in advanced semiconductor packaging, module engineering, and test methodology development. Interns will have the opportunity to: • Work closely with Module Engineering, Integration, and Tooling Design teams • Contribute to process development, test capability enhancement, and module readiness • Support critical experiments, structured data analysis, and early stage technology pathfinding • Participate in engineering problem solving for next generation packaging technologies High performing interns may be considered for full time opportunities upon graduation. Behavioral traits that we are looking for: • Strong analytical and problem solving skills, with the ability to operate effectively in a fast paced and ambiguous environment. • Strong communication skills and the ability to collaborate within cross functional engineering teams

Requirements

• Currently pursuing a Master’s or PhD degree in Mechanical Engineering, Chemical Engineering, Materials Science, Chemistry, Polymer Engineering, or a related engineering discipline.
• 6+ months of education/work experience in the following: Research or laboratory experience involving semiconductor packaging, materials processing, or relevant experimental work.
• Exposure to industry standard test methodologies, including burn in, class test flows, reliability screening, and product validation techniques.

Nice To Haves

• Experience using data analysis tools such as MATLAB, Python, or JMP.
• Hands on experience with process optimization, DOE (Design of Experiments), and troubleshooting engineering tools or fixtures.
• Willingness to perform hands on test engineering work in cleanroom environments for extended periods.

Responsibilities

• Work closely with Module Engineering, Integration, and Tooling Design teams
• Contribute to process development, test capability enhancement, and module readiness
• Support critical experiments, structured data analysis, and early stage technology pathfinding
• Participate in engineering problem solving for next generation packaging technologies

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

What This Job Offers

• Career Level: Intern
• Number of Employees: 5,001-10,000 employees