The candidate will be a key member of the plasma etch team tasked with driving technical solutions and enabling next‑generation plasma etch platforms for RF GaAs based integrated circuits. Responsibilities include process ownership of plasma etch modules, leading technology transitions to newer etch platforms, and ensuring robust integration with upstream and downstream process modules. The role requires close collaboration with cross‑functional groups to ensure manufacturable processes that meet quality, yield, and reliability requirements. The ideal candidate will have greater than 5 years of process ownership experience with a strong, hands‑on understanding of plasma etch fundamentals, including plasma chemistry, etch selectivity, profile and CD control, and defect mechanisms. Demonstrated strength in data analysis, statistical process control, and structured problem‑solving is required, along with the ability to drive root‑cause investigations and implement sustainable process improvements.
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Job Type
Full-time
Career Level
Mid Level
Number of Employees
1,001-5,000 employees