Staff Engineer, APTD Dry Etch

Micron Technology • Boise, ID

3d

About The Position

The Advanced Packaging Technology Development (APTD) team at Micron drives the technologies that enable the AI era. We work hands‑on with global R&D, suppliers, and manufacturing teams to turn breakthrough ideas into production‑ready solutions. Our work sits at the intersection of innovation, scale, and real‑world impact—and collaboration is how we win. Artificial intelligence is transforming the world, and High Bandwidth Memory (HBM) is at the center of that transformation. As a Senior or Staff Engineer on the Dry Etch R&D team, you will play a key role in developing and scaling plasma‑based etch processes that enable next‑generation packaging technologies. This role offers deep technical ownership, broad cross‑functional collaboration, and the opportunity to influence long‑term technology roadmaps from early research through high‑volume manufacturing.

Requirements

• Bachelor’s degree in Chemical, Mechanical, Electrical, Materials Science, Physics, Chemistry, Semiconductor Engineering, or related field with 5+ years of relevant dry etch experience OR Master’s or PhD in a related discipline with 3+ years of relevant dry etch experience in the semiconductor industry
• Demonstrated hands‑on R&D experience advancing process performance through structured experimentation
• Proven ability to apply DOE, data analysis, and first‑principles reasoning to complex process problems
• Ability to work independently while managing multiple technical priorities and program commitments

Nice To Haves

• Deep expertise in plasma etch processes and plasma–material interactions for advanced patterning
• Experience influencing technology direction, integration strategies, or long‑term process roadmaps
• Exposure to advanced packaging technologies such as TSV, RDL, hybrid bonding, or 2.5D/3D integration
• Proficiency in statistical process control and variability reduction methodologies
• Familiarity with Python, data automation, or GenAI‑enabled analysis for process development

Responsibilities

• Develop and optimize dry etch process modules to meet performance, yield, and reliability requirements for advanced packaging products
• Drive process capability, cost, and variability improvements using data‑driven experimentation and equipment innovation
• Collaborate closely with process integration and adjacent process teams including Wet Etch, Films, Lithography, CMP, Wafer Trim, and Bonding
• Perform root‑cause and failure‑mode analysis and partner with equipment vendors to resolve complex process and hardware challenges
• Support global process transfer and readiness for high‑volume manufacturing, including occasional international travel

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Senior