Sr Staff Package Design Engineer
About The Position
Renesas is seeking a Sr. Staff Packaging Engineer to work with the Sr Manager on development activities for Power Module New Product Introductions, specifically those using embedded die laminate technology with SMT of Cap and Inductor for commercial industrial power device packaging in servers and AI applications. The role involves attending team meetings, reporting development status to AI Task Force executives, and committing to additional actions for Power Module development. The engineer will also be responsible for developing and maintaining technical expertise in Power Module packaging technology and participating in packaging roadmap development and execution. Renesas is an embedded semiconductor solution provider focused on making lives easier through scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries. The company offers a flexible and inclusive work environment with a hybrid model, fostering innovation, collaboration, and continuous learning.
Requirements
- Doctorate/Masters / Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
- 5-12 years of relevant experience in package development emphasizing Power Module plastic package.
- Understanding of semiconductor Power Module plastic IC assembly processes, materials and technology.
- Knowledge of AutoCAD, Excel, PowerPoint, Word.
- Knowledge of wire-bonding, flip chip, SMT SPC (Statistical Process Control), and statistical analysis.
- Strong interpersonal and communication skills.
- Strong analytical and presentation skills.
Responsibilities
- Work with Sr Manager to understand development activities for Power Module New Product Introductions which use embedded die laminate technology with SMT of Cap and Inductor for Renesas’s packaging needs in the areas of Commercial Industrial power device packaging for servers and AI.
- Attend all team meetings for development activities for Power Module New Product Introductions which use embedded die laminate technology with SMT of Cap and Inductor for Renesas’s packaging needs in the areas of Commercial Industrial power device packaging for servers and AI.
- Report status and next steps of development activities for Power Modules for Commercial Industrial power device packaging for servers and AI power applications to AI Task Force executives and commit additional actions for Power Module development to AI Task Force.
- Develop and maintain technical expertise on advances and innovations in Power Module packaging technology.
- Participate in packaging roadmap development & focus on execution.
Benefits
- Launch and advance your career in technical and business roles across four Product Groups and various corporate functions.
- Opportunities to explore hardware and software capabilities and try new things.
- Maximize your performance and wellbeing in our flexible and inclusive work environment.
- People-first culture and global support system, including the remote work option and Employee Resource Groups.
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
What This Job Offers
Job Type
Full-time
Career Level
Senior
Number of Employees
5,001-10,000 employees
