Sr. RFIC Advanced Packaging Engineer

Lockheed Martin•Moorestown, NJ

20h•Onsite

About The Position

At Lockheed Martin Rotary and Mission Systems, we are driven by innovation and integrity. We believe that by applying the highest standards of business ethics and visionary thinking, everything is within our reach – and yours as a Lockheed Martin employee. Lockheed Martin values your skills, training and education. Come and experience your future! The Work In an emerging semi-conductor market we are seeking an experienced RF Integrated Circuits (IC) Advanced Packaging Design Engineer to join the IC Design team in Moorestown NJ. The successful candidate will architect concepts, design, test, and release to production 2.5 and 3 Dimensional Heterogeneously Integrated (2.5/3DHI) packaged solutions for defense applications. In this role you will be involved with project leadership throughout the entire product development cycle and will interface with customers, various engineering disciplines including advanced packaging mechanical engineers, lab technicians, vendors and suppliers. - The engineer will have the opportunity to Architect RF/Analog System In Package (SIP) and or 3D Heterogeneously Integrated (3DHI) Multi-IC sub-system designs. - The engineer will develop packaging floor planning, and detailed routing of packaged systems in step with advanced packaging mechanical engineers. -The engineer will have the opportunity to work on and collaborate with cross functional teams with other engineering disciplines. - The engineer will use state of the art EDA tools including Keysight ADS, Ansys HFSS, Cadence Virtuoso Studio, AWR and Allegro X Advanced Packaging Designer. -The engineer will have the opportunity participate in the design of RF/Analog Mixed Signal/MMICs in state of the art Bi-CMOS, SiGe-CMOS, GaAs, GaN, InP technology nodes. -The engineer will have the opportunity to mentor less experienced engineers. -The engineer will have the opportunity to attend industry conferences and to keep up-to-date on related industry best practices and technological advancements. -We offer a continuous learning environment with strong career growth and advancement opportunities Why Join Us Your Health, Your Wealth, Your Life Our flexible schedules, competitive pay and comprehensive benefits enable you to live a healthy, fulfilling life at and outside of work. Learn more about Lockheed Martin’s competitive and comprehensive benefits package.

Requirements

Must have a BSEE OR BSCE or other relevant technical degree from an accredited university / college.
Ability to obtain a secret clearance is required.
Minimum 5 years of industry experience in RF/Analog/Mixed Signal circuit schematic capture, simulation, and layout using Cadence, Siemens or similar PCB EDA tools is required.
RF Architecture / RF Sub-system design is highly desired.
Strong RF skills using Keysight ADS, AWR, Ansys HFSS or similar RF simulation platforms is required.
Technical and program leadership is required to assist IPTLs and PMs
The ability to collaborate effectively is required.

Nice To Haves

Experience in IC design packaging, SIP, 2.5/3DHI systems or working knowledge is desired.
IC design experience or working knowledge of RF/Analog Mixed Signal/MMICs in state of the art Bi-CMOS, SiGe-CMOS, GaAs, GaN, InP technology nodes is desired.
Documentation of requirements, simulation, and verification in support of design assurance and reuse.
Development of verification plans for next higher assembly integration.
Strong RF Simulation skills using Keysight ADS and or AWR simulation platforms
Strong Hspice analog circuit analysis skills inclusive of statistical design variations.
Use of standard lab equipment, i.e. oscilloscopes, signal generators, spectrum analyzers, and etc.

Responsibilities

Architect RF/Analog System In Package (SIP) and or 3D Heterogeneously Integrated (3DHI) Multi-IC sub-system designs.
Develop packaging floor planning, and detailed routing of packaged systems in step with advanced packaging mechanical engineers.
Work on and collaborate with cross functional teams with other engineering disciplines.
Use state of the art EDA tools including Keysight ADS, Ansys HFSS, Cadence Virtuoso Studio, AWR and Allegro X Advanced Packaging Designer.
Participate in the design of RF/Analog Mixed Signal/MMICs in state of the art Bi-CMOS, SiGe-CMOS, GaAs, GaN, InP technology nodes.
Mentor less experienced engineers.
Attend industry conferences and to keep up-to-date on related industry best practices and technological advancements.