Sr. Mechanical Design Engineer – New Product Development

KLA•Milpitas, CA

3d•Onsite

About The Position

Company Overview KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen, VR device or smart car would have made it into your hands without us. KLA invents systems and solutions for the manufacturing of wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. The innovative ideas and devices that are advancing humanity all begin with inspiration, research and development. KLA focuses more than average on innovation and we invest 15% of sales back into R&D. Our expert teams of physicists, engineers, data scientists and problem-solvers work together with the world’s leading technology providers to accelerate the delivery of tomorrow’s electronic devices. Life here is exciting and our teams thrive on tackling really hard problems. There is never a dull moment with us. Group/Division With over 40 years of semiconductor process control experience, chipmakers around the globe rely on KLA to ensure that their fabs ramp next-generation devices to volume production quickly and cost-effectively. Enabling the movement towards advanced chip design, KLA's Global Products Group (GPG), which is responsible for creating all of KLA’s metrology and inspection products, is looking for the best and the brightest research scientist, software engineers, application development engineers, and senior product technology process engineers. The Broadband Plasma Division (BBP) provides market-leading patterned wafer optical inspection systems for leading-edge IC manufacturing. Logic, foundry, and memory customers depend on BBP products to detect yield-critical defects for process debug and excursion monitoring at advanced process nodes. BBP flagship products include the 29xx and 39xx series which leverage Broadband Plasma technology to capture a wide range of defects with ultimate sensitivity at the optical inspection speeds needed for inline defect monitoring. Job Description/Preferred Qualifications Key Responsibilities Design, build, prototype testing the next generation wafer inspection equipment. Create innovative designs involving a combination of the following: precision mechanisms, vacuum systems, vibration isolation, advanced tooling, and electronic packaging. Design robust mechanical components, modules, and subsystems. Work with cross-functional engineering teams, including systems, manufacturing, and service engineers, to derive subsystem requirements and conduct design reviews. Generate, review, and release comprehensive engineering drawings and documentation to ensure a seamless transition from design to production. Deliver working solutions by collaborating closely with cross-functional engineering teams, including systems, manufacturing, and service engineers, to ensure smooth integration and testing at both subsystem and system levels. Develop and manage vendor relationships: component fabrication, manufacturing process transfer, qualification.

Requirements

Full-time onsite is required
Doctorate (Academic) Degree and related work experience of 3 years
Master's Level Degree and related work experience of 6 years
Bachelor's Level Degree and related work experience of 8 years

Nice To Haves

Proficient in 3D CAD modeling and 2D mechanical drawing. Experience with PTC Creo is preferred.
Tolerance analysis, GD&T, error budgeting.
Experience with mechanical design, testing and troubleshooting.
Familiarity with mechanical manufacturing processes including machining, sheet metal fabrication, welding, etc.
Knowledge of Finite Element Analysis (FEA) tools for thermal, structural, and modal analyses.
Excellent written and verbal communication (written and verbal) and team work skills. Ability to work with cross-functional teams.
Experience in one or more of the following areas is strongly desired: semiconductor equipment design, precision mechanical design, vacuum system design, structural and/or thermal FEA (ANSYS or COMSOL)

Responsibilities

Design, build, prototype testing the next generation wafer inspection equipment.
Create innovative designs involving a combination of the following: precision mechanisms, vacuum systems, vibration isolation, advanced tooling, and electronic packaging.
Design robust mechanical components, modules, and subsystems.
Work with cross-functional engineering teams, including systems, manufacturing, and service engineers, to derive subsystem requirements and conduct design reviews.
Generate, review, and release comprehensive engineering drawings and documentation to ensure a seamless transition from design to production.
Deliver working solutions by collaborating closely with cross-functional engineering teams, including systems, manufacturing, and service engineers, to ensure smooth integration and testing at both subsystem and system levels.
Develop and manage vendor relationships: component fabrication, manufacturing process transfer, qualification.