Design, build, prototype testing the next generation broad band plasma (BBP) Wafer inspection opto-mechanical assemblies. Work with system, optical, electrical and software engineer to derive the subsystem requirements and conduct design reviews. Lead group of engineers for technical development, vendor management, schedule & product cost management. CAD Modeling: Cero experience preferred Track record of full life cycle high precision (sub-micron level) mechanism development experience. High accuracy alignment & adjustment design, design for repeatability & stability, tolerance analysis, design for reliability, design for vibration Thermal management design: electronics thermal management, cooling flow simulation & optimization. CAE: thermal & structural simulation (ANSYS experience preferred) Qualify and release the mechanism design, provide support for onsite manufacturing. Collaborate with manufacturing team during product ramp-up to support and trouble-shoot product issues. Full-time onsite is required.
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Job Type
Full-time
Career Level
Mid Level
Industry
Computer and Electronic Product Manufacturing
Education Level
Ph.D. or professional degree
Number of Employees
5,001-10,000 employees