Advanced Packaging Technology and Manufacturing (APTM) Yield and Product Engineering is looking for an engineering leader to establish, develop and scale the end-to-end product engineering (PE) team that optimizes advanced packaging products for design, testability, yield and quality for predictable execution and continuous cost and quality improvements. The PE group leader is responsible for managing the engineering teams leading APTM efforts on product optimization for DFx, yield, quality and manufacturability spanning execution from definition, technology development through high volume manufacturing. This role is accountable for driving optimized solutions across a broad spectrum of advanced packaging technologies while meeting the highest quality standards for internal and external customers. In this pivotal role, you will shape the priorities for a high-performing product engineering team, ensuring the delivery of high-quality outcomes that meet Intel's standards for innovation, cost optimization, and operational excellence.
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Job Type
Full-time
Career Level
Mid Level
Number of Employees
5,001-10,000 employees