Solder Assembler - 2nd Shift

Butler Technical Group•Oldsmar, FL

34d•$23 - $26•Onsite

About The Position

We are seeking a detail oriented Solder Assembler with a strong understanding of IPC (Institute of Printed Circuits) standards to join our manufacturing team. The successful candidate will be responsible for assembling printed circuit boards (PCBs) by soldering a wide variety of components, performing defect identification, and ensuring all work meets stringent quality and reliability requirements. Perform manual and/or selective soldering of through hole, surface mount (SMT), BGA, QFN, CSP, and other component types. Conduct visual inspections and use inspection tools (e.g., microscopes, AOI) to identify solder defects such as bridges, cold joints, tombstoning, insufficient wetting, and voids. Apply IPC A 610 (Acceptability of Electronic Assemblies), IPC J STD 001 (Soldering Materials), and IPC 2221 & IPC 2222 (Design standards) throughout the assembly process. Verify that solder paste, flux, and materials meet required specifications. Recommend and implement enhancements to soldering processes, tooling, and work instructions. Follow all safety procedures, including proper handling of hazardous materials and use of personal protective equipment (PPE).

Requirements

IPC-A-610, Required: Yes,
IPC-J-STD, Required: Yes
Soldering, Required: Yes
Minimum 2years of hands on solder assembly in a production environment.
Proficient with IPC standards (A 610, J STD 001, etc.)
Ability to solder and inspect a range of component sizes (0201 - 1206, BGAs, QFNs, etc.)
Familiarity with soldering tools (soldering iron, hot air gun, reflow oven, wave solder machine).
Strong visual inspection skills; ability to use microscopes and AOI equipment to detect defects.
Detail oriented, strong problem solving abilities, effective communication, and teamwork orientation.
Experience with mixed technology boards (both SMT and through hole).
Knowledge of lead free and RoHS compliant processes.
Familiarity with statistical process control (SPC) and yield analysis.
Ability to lift up to 25lb (e.g., boxes of PCBs, tooling).
High school diploma or GED
Must be able to read/write English
Pass a medical exam / physical
High school diploma or GED; technical/vocational training in electronics assembly preferred.
min. 2 years of IPC 610 soldering experience, certificate not required only the experience working in IPC610 standards

Responsibilities

Perform manual and/or selective soldering of through hole, surface mount (SMT), BGA, QFN, CSP, and other component types.
Conduct visual inspections and use inspection tools (e.g., microscopes, AOI) to identify solder defects such as bridges, cold joints, tombstoning, insufficient wetting, and voids.
Apply IPC A 610 (Acceptability of Electronic Assemblies), IPC J STD 001 (Soldering Materials), and IPC 2221 & IPC 2222 (Design standards) throughout the assembly process.
Verify that solder paste, flux, and materials meet required specifications.
Recommend and implement enhancements to soldering processes, tooling, and work instructions.
Follow all safety procedures, including proper handling of hazardous materials and use of personal protective equipment (PPE).