DMTS SiPh Packaging & Assembly Materials

GlobalFoundries•Austin, VT

17h

About The Position

GlobalFoundries (GF) is a leading full-service semiconductor foundry offering design, development, and fabrication services. Their Advanced Packaging and Photonics Center (APPC) focuses on next-generation optical interconnects and heterogeneous integration (HI) for AI, HPC, and data center applications, with a global manufacturing presence. This DMTS-grade position is tasked with driving GF’s Photonix platform growth to deliver world-class fully packaged electro-optical transceiver offerings using 2.5D and 3D co-packaged optics. The role requires a strong emphasis on product and module reliability, package risk factors, packaging design rules, materials selection, and defining electrical, photonic, and thermal stress plans for chiplet and product module reliability qualification. Competency in defining test and measurement methodologies for modules capable of over 6.4Tbps data transfer is essential. The successful candidate will have a validated record of photonic and electrical interconnect innovation and product release/partnership within the optical/electrical OSAT ecosystem. Expertise in product definition for photonic and electronic packages is required, with a primary focus on ensuring compatibility between photonic interconnect and packaging solutions and current state-of-the-art electrical interconnect solutions. Optical fiber attach options are expected to include detachable fiber optic couplers, grating couplers, edge couplers, passive V-groove, and 3D MEMs spot size converters, all compatible with 3D electrical interconnect solutions such as Copper RX, Copper uPillar, chip-on-wafer hybrid bonding, and wafer-to-wafer hybrid bonding.

Requirements

MS, or PhD + 20 or more years of experience
Expertise in photonic and electronic package architecture definition
Broad and deep knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing.
Experience in bringing packaged products from development into production for data centers, automotive and communications
Expert in chip package interaction for 2D, 2.5D, 3D SiPh advanced packaging

Nice To Haves

A record of distinguished leadership on national and international levels such as contributing to national R&D agendas in science & technology, manufacturing.
Participation in industry standards boards
Materials science, thermal, mechanical, simulation background
Extensive experience with failure analysis, design of experiments, & packaging process integration

Responsibilities

Act as a hands-on GF technical subject matter expert for SiPhotonics packaging, responsible for answering internal and external questions and building GF capability through shared knowledge training and recruitment efforts.
Provide leadership and training to engineers in product packaging design reviews, materials selection, and FMEAs of customer packaging concepts.
Protect clients by ensuring that the maturity of a given technology, technology models, packaged design rules, and IP meets industry expectations.
Ensure that all new technologies and features meet a standardized set of quality expectations tied to implementation into application representative packages for Data Centers, Automotive, and Communications.
Drive GF leadership in global SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems.
Provide tools and complex analysis of quality issues and associated financial implications.
Protect the business by ensuring that all necessary requirements are met and that a technology performs to the expectations of a given customer or market to avoid costly re-designs.
Ensure standardization of site-based quality processes are executed appropriately.
Drive increased discipline and qualification robustness through a consistent global qualification process.
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.