Silicon Packaging Design Engineer

Intel • Chandler, AZ

6d • Onsite

About The Position

As an integral part of Intel's new Integrated Device Manufacturer 2.0 (IDM2.0) strategy, we are establishing Foundry Services (FS), a fully vertical, stand-alone foundry business, reporting directly to the CEO. Foundry Services will be a world-class foundry business and major provider of US and European based capacity to serve customers globally. Foundry Services will be differentiated from other foundries with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe, and a world-class IP portfolio that customers can choose from, including x86 cores, graphics, media, display, AI, interconnect, fabric and other critical foundational IP's, along with Arm and RISC-V ecosystem IPs. Foundry Services will also provide access to silicon design services to help our customers seamlessly turn silicon into solutions, using industry standard design packages. Silicon Packaging Design Engineer job responsibilities include but not limited to: Drives end-to-end development for substrate design from concept through tape out and implements physical layout and routing of the package design. Performs substrate fit and routing studies to establish design, performance, and cost tradeoffs. Works closely with silicon and hardware teams to optimize silicon, package, board performance and pinout. Defines substrate design rules, conducts internal and external reviews, analyzes data, and resolves DRCs to optimize package design. Completes documentation and collateral into the product lifecycle management system of record.

Requirements

• You must possess the below requirements to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
• Minimum Qualifications: Bachelor's degree in Mechanical Engineering, Electrical Engineering or related field with 6+ months of relevant experience, -OR- Master's degree in Mechanical Engineering, Electrical Engineering or related field with 1+ years of relevant experience
• Relevant Experience must include the following: Familiarity with Cadence APD, Siemens Xpedition, or CAD software, and readiness to troubleshoot a wide variety of physical design/layout issues.
• Prior experience with physical layout aspects of substrate design/layout including but not limited to custom layouts, floor plans, or schematic layout conversion.

Nice To Haves

• Performing package I/O routing starting day one.
• Strong analytical ability and problem-solving skills: identifying, isolating, and debugging issues and providing creative solutions.
• Microelectronic package substrate technology development.
• Package design tools such as Package Layout Automation (PLA) and FIELD.
• Microelectronic package electrical modeling and simulation tools such as PowerDC, HyperLynx, Q3D, and HFSS.
• Extract signal integrity and/or power delivery electrical models and run AC/DC/Frequency Domain simulations.
• Scripting using Python, VB, C, and/or other language.

Responsibilities

• Drives end-to-end development for substrate design from concept through tape out and implements physical layout and routing of the package design.
• Performs substrate fit and routing studies to establish design, performance, and cost tradeoffs.
• Works closely with silicon and hardware teams to optimize silicon, package, board performance and pinout.
• Defines substrate design rules, conducts internal and external reviews, analyzes data, and resolves DRCs to optimize package design.
• Completes documentation and collateral into the product lifecycle management system of record.

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel .

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level
• Number of Employees: 5,001-10,000 employees