Senior Silicon Design Engineer - Packaging and Co-Design - TeraWave
About The Position
At Blue Origin, we envision millions of people living and working in space for the benefit of Earth. We’re working to develop reusable, safe, and low-cost space vehicles and systems within a culture of safety, collaboration, and inclusion. Join our team of problem solvers as we add new chapters to the history of spaceflight! This role is part of TeraWave, a satellite communications network designed to deliver symmetrical data speeds of up to 6 Tbps anywhere on Earth. This network will service tens of thousands of enterprise, data center, and government users who require reliable connectivity for critical operations. We are seeking a Senior Silicon Design Engineer specializing in Packaging and Co-Design for our revolutionary TeraWave satellite communications network. This role will be instrumental in developing advanced silicon solutions that enable our constellation to deliver symmetrical data speeds of up to 6 Tbps globally. The ideal candidate brings expertise in advanced packaging technologies, system-in-package design, and silicon co-design methodologies, thriving in a fast-paced environment where innovation meets mission-critical execution.
Requirements
- B.S. degree in Electrical Engineering, Computer Engineering, or related field
- 8+ years of experience in silicon design with focus on advanced packaging technologies
- Demonstrated expertise in system-in-package design and heterogeneous integration
- Experience with 2.5D/3D packaging technologies including interposers and chiplets
- Knowledge of high-speed signaling in advanced packages
- Experience with thermal and mechanical co-design for complex silicon solutions
- Understanding of radiation effects on semiconductor devices and packaging materials
- Proficiency with industry-standard EDA tools for package design and simulation
Nice To Haves
- M.S. or Ph.D. in Electrical Engineering with focus on semiconductor packaging
- Experience with space-grade packaging technologies and qualification processes
- Knowledge of RF/microwave packaging techniques for high-frequency applications
- Experience with power delivery network design for complex multi-die packages
- Background in designing for harsh environments including thermal cycling and radiation
- Experience with silicon photonics integration and optical I/O technologies
- Understanding of advanced cooling solutions for high-performance computing in space
- Familiarity with reliability physics and failure mechanisms in advanced packages
Responsibilities
- Define and architect custom silicon solutions including DSPs, SDR components, beamforming processors, and network processing units optimized for advanced packaging technologies
- Lead technical architecture decisions and requirements definition for space-optimized processing solutions with focus on heterogeneous integration
- Drive 2.5D and 3D packaging strategies including silicon interposers, chiplets, and advanced substrate technologies
- Lead end-to-end ASIC/FPGA development from requirements through RTL design, verification, synthesis, physical design, and post-silicon validation
- Develop co-design methodologies integrating electrical, thermal, and mechanical considerations for complex multi-die packages
- Manage design flows and coordinate with foundry and packaging partners to ensure manufacturability
- Implement and verify radiation tolerance techniques including SEU mitigation, TMR, ECC, and RHBD methodologies
- Coordinate radiation testing and qualification campaigns to ensure space survivability
- Drive design standards, verification strategies, IP library development, and documentation for advanced packaging
- Establish design flows and best practices for space-grade silicon engineering across the program
- Collaborate cross-functionally with systems engineers, RF engineers, avionics teams, thermal engineers, and software developers
- Support requirements flow-down and interface definitions between chiplets and package components
- Lead technical risk assessment and Failure Investigation Teams (FITs) for silicon design issues, radiation-induced failures, and flight anomalies
- Develop mitigation strategies and corrective actions for packaging-related challenges
- Provide recommendations for capital investments in EDA tools, verification platforms, emulation systems, and validation equipment
Benefits
- Medical, dental, vision, basic and supplemental life insurance, paid parental leave, short and long-term disability, 401(k) with a company match of up to 5%, and an Education Support Program.
- Up to four (4) weeks per year based on weekly scheduled hours, and up to 14 company-paid holidays.
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What This Job Offers
Job Type
Full-time
Career Level
Senior
